LED Lighting System Heat Dissipation via Adhesive Layer
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Solution Overview
Problem
Existing LED lighting systems face challenges with high costs and inadequate heat dissipation, particularly when using metal core printed circuit boards, and flexible printed boards struggle with heat radiation capabilities.
Innovation Solution
A lighting system design featuring a substrate with an adhesive layer, lead frames, and LEDs, where the ratio of the contact area between the lead frames and the adhesive layer is optimized for effective heat radiation, along with a thermal conductivity of 1.7 W/m-K or more, and a transparent sealing material to bond packages and substrates, ensuring efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal core printed circuit board is used to arrange LED packages, then heat dissipation is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive metal core printed circuit boards with inexpensive flexible printed boards that have adequate service life for backlight applications. The flexible PCB achieves acceptable heat dissipation through optimized LED arrangement and adhesive layer design without requiring costly metal substrates.
Solution Approach 2:
The patent changes the thermal management approach by optimizing the contact area ratio between lead frames and adhesive layer (500 or more) and selecting adhesive materials with specific thermal conductivity (1.7 W/m-K or more). This parameter optimization enables effective heat dissipation on flexible substrates without metal cores.
2Ease of manufacture
If a flexible printed board is used to arrange LED packages, then manufacturing cost decreases, but heat radiation capability deteriorates
Solution Approach 1:
The patent optimizes thermal parameters by ensuring the adhesive layer has thermal conductivity of 1.7 W/m-K or more and the contact area ratio between lead frames and adhesive layer is 500 or more. These parameter changes enable flexible PCBs to achieve adequate heat radiation capability.
Solution Approach 2:
The patent enhances heat radiation at critical locations by optimizing the lead frame adhesive contact areas and selecting high thermal conductivity adhesive materials at the LED package-substrate interface, while maintaining the overall flexibility and low cost of the flexible printed board structure.
3Temperature
If the contact area ratio between lead frames and adhesive layer is increased, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent achieves effective heat dissipation by optimizing the contact area ratio parameter to 500 or more between lead frames and adhesive layer. This parameter optimization enables simple structural implementation with standard LED packages and flexible PCBs without requiring complex heat sink structures or additional thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a low-cost, highly effective heat-radiating LED lighting system and display apparatus, maintaining temperature rise below 3°C with improved light intensity and reliability by effectively spreading heat through high thermal conductivity materials and large contact areas.
Implementation Method 1
the thermal conductivity of the adhesive layer is 1.7 W/m-K or more
Data Source
AI summary
The present invention provides a low-cost and highly heat-radiating lighting system and a display apparatus using the same. The lighting system has a plurality of packages, each containing LEDs, lead frames and a transparent sealing material, a heat-radiating substrate and an adhesive layer adapted to bond the packages and the heat-radiating substrate. The lead frames are 0.1 mm or more in thickness. Further, the area of the surfaces of the heat-radiating substrate and the lead frames bonded together via the adhesive layer is 70 mm2 per 1 mm2 area of the LEDs. The display apparatus of the present invention uses the lighting system as the backlight thereof.