LED Package Adhesive Thickness for Light Convergence

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Solution Overview

Problem

The increasing demand for brighter light emissions from LEDs in various applications poses a challenge due to limitations in the brightness and efficiency of existing light emitting device packages.

Innovation Solution

A light emitting device package design that includes a Zener diode and a light emitting diode, with lead frames and adhesive members, where the thickness of the second adhesive member is equal to or less than the first adhesive member, optimizing the orientation and convergence of light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the thickness of the second adhesive member is increased to improve light emission brightness, then light emission intensity increases, but light emission efficiency and convergence deteriorate

Engineering Contradiction:
Improvelight emission brightnessVSAvoidlight emission efficiency
Core Design Contradiction:
Illumination intensityVSLoss of energy

Solution Approach 1:

The patent applies parameter changes by precisely controlling the thickness of the second adhesive member to be equal to or less than the thickness of the first adhesive member. This parameter optimization ensures that light emitted from the LED maintains proper orientation and convergence angles, preventing light loss while achieving desired brightness levels. The thickness parameter is critical for balancing illumination intensity with emission efficiency.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If the thickness of the second adhesive member is increased to simplify manufacturing, then fabrication process becomes easier, but light orientation and convergence are compromised

Engineering Contradiction:
Improvefabrication process simplicityVSAvoidlight orientation precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent establishes a clear parameter relationship (thickness of second adhesive member ≤ thickness of first adhesive member) that provides manufacturing guidance while ensuring optical performance. This parameter specification enables manufacturers to achieve proper light orientation and convergence without requiring complex adjustment processes, thus maintaining both ease of manufacture and manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances light emission efficiency and brightness by adjusting the orientation angle of light emitted from the LEDs, improving convergence and reducing light loss, while simplifying the fabrication process and reducing manufacturing costs.

Implementation Method 1

light emitting diodes (LEDs) are devices which convert an electrical signal into light, such as infrared light or visible light, using characteristics of a compound semiconductor

Methodology Applied
Scientific EffectLight emitting diode effect: Light Emitting Diode

Implementation Method 2

a first adhesive member disposed between the Zener diode and the lead frames, and a second adhesive member disposed between the light emitting device and the lead frames

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9202806B2Light emitting device package
Publication Date: 2015.12.01 SUZHOU LEKIN SEMICON CO LTD
  • US9202806B2 patent drawing
  • US9202806B2 patent drawing
  • US9202806B2 patent drawing

AI summary

Disclosed is a light emitting device package. The light emitting device package includes a Zener diode, a light emitting device including a light emitting diode, a body including lead frames on which the light emitting device and the Zener diode are disposed, and provided with a cavity formed on the lead frames, a first adhesive member disposed between the Zener diode and the lead frames, and a second adhesive member disposed between the light emitting device and the lead frames, and the thickness of the second adhesive member is equal to or less than the thickness of the first adhesive member.