LED Display Adhesive Structure for Reliable Element Transfer
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Solution Overview
Problem
The transfer of inorganic-based light-emitting elements in LED display devices is prone to damage, tilting, or flipping during the transfer process, leading to transfer failures due to mismatched pitches between the element substrate and the display device substrate, requiring complex and inefficient steps.
Innovation Solution
A light-emitting diode display device design featuring a substrate with a first electrode, a bank layer with an opening, an adhesive layer with uneven side surfaces, and a light-emitting element positioned on the adhesive layer, which includes a separated portion to minimize impact and facilitate direct transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If complex transfer steps are used to transfer light-emitting elements from element substrate to display device substrate, then transfer precision can be improved, but device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
A transfer substrate is introduced as an intermediary carrier between the element substrate and the display device substrate. The light-emitting elements are first transferred to the transfer substrate, which then serves as a temporary platform for precise positioning and transfer to the final substrate, reducing direct complexity between source and destination
Solution Approach 2:
The transfer process is divided into distinct stages: (1) transfer from element substrate to transfer substrate, (2) positioning on transfer substrate, and (3) transfer from transfer substrate to display device substrate. This segmentation allows each stage to be optimized independently, improving overall precision without proportionally increasing complexity
2Ease of manufacture
If direct transfer of light-emitting elements is performed, then manufacturing process is simplified, but transfer failures occur due to damage, tilting, or flipping from impacts
Solution Approach 1:
The transfer substrate is designed with a cushioning layer that provides shock absorption during the transfer process. This pre-positioned cushioning structure protects the light-emitting elements from impacts that would cause damage, tilting, or flipping, while maintaining a relatively simple direct transfer approach
Solution Approach 2:
The cushioning layer's mechanical properties (softness, elasticity) are optimized to provide sufficient protection during transfer while maintaining element positioning accuracy. By adjusting the physical parameters of the cushioning material, both reliability and manufacturing simplicity are achieved
3Manufacturing precision
If pitch mismatch between element substrate and display device substrate is addressed through complex transfer steps, then positioning accuracy is improved, but production efficiency decreases
Solution Approach 1:
The transfer substrate is pre-configured with positioning structures and alignment marks before the transfer process begins. This preliminary preparation enables rapid and accurate positioning during transfer, eliminating the need for time-consuming complex alignment procedures while maintaining high positioning accuracy
Solution Approach 2:
The transfer substrate replicates the pitch and positioning pattern of the display device substrate, creating a compatible intermediate platform. This copying approach allows direct transfer without complex pitch conversion steps, improving both accuracy and production efficiency
Data Source
AI summary
A light-emitting diode display device and method of manufacturing the same are provided. The light-emitting diode display device includes a substrate; a first electrode over the substrate; a first bank layer on the first electrode and having a first opening exposing the first electrode; an adhesive layer including a first portion on the first electrode exposed through the first opening; and a light-emitting element provided on the first portion of the adhesive layer, wherein the first portion has a side surface provided with a plurality of unevenness.