LED Structure with Adjacent Electrodes for Simultaneous Soldering
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Solution Overview
Problem
Conventional light-emitting diode (LED) packaging methods require numerous conductive wires for connections, leading to increased risk of wire breakage and limited throughput due to precise alignment needs, especially as the number of LEDs increases.
Innovation Solution
A light-emitting diode structure with adjacent LEDs having electrical coupling sides and electrodes positioned close enough for simultaneous soldering, utilizing a conductive layer that connects one LED's electrode to the adjacent LED's electrode area, reducing the need for multiple wires and facilitating easier alignment during packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire-soldering method is used to connect multiple LEDs, then electrical connections can be established, but the number of conductive wires increases leading to higher risk of wire breakage and limited throughput
Solution Approach 1:
The patent merges multiple wire-soldering operations into a single simultaneous soldering process by positioning electrodes of adjacent LEDs close to each other, allowing multiple electrical connections to be established at once rather than sequentially with individual wires
Solution Approach 2:
The patent extracts and eliminates the need for multiple separate conductive wires by implementing direct electrode-to-electrode connections through the substrate, removing the intermediate wire components that are prone to breakage
2Manufacturing precision
If precise control is required for wire-soldering machine alignment, then connection accuracy can be achieved, but the throughput of the soldering process is limited
Solution Approach 1:
The patent combines multiple alignment operations into a single positioning step by arranging electrodes spatially adjacent to each other, allowing the soldering machine to complete multiple connections simultaneously without repeated positioning and alignment cycles
Solution Approach 2:
The patent performs preliminary positioning of LEDs during the mounting process, pre-establishing the spatial relationship between adjacent electrodes before soldering, so that no additional alignment control is needed during the subsequent soldering operation
Data Source
AI summary
Disclosed is a light-emitting diode structure comprises a substrate, a plurality of light-emitting diodes on the substrate, and a conductive layer laid on the surface thereof. Each light-emitting diode comprises at least an electrical coupling side close to another electrical coupling side of an adjacent light-emitting diode. Each light-emitting diode comprises at least a first and a second electrode on the surface along the electrical coupling side, so that two close first or second electrodes can be soldered at the same time in wire soldering process, so as to make the light-emitting diodes connect in parallel. One end of the conductive layer is connected to the first electrode of a light-emitting diode and the other end is close to the second electrode of another light-emitting diode, so that the second electrode and the conductive layer can be soldered at the same time in wire soldering process, so as to make the light-emitting diodes connect in series.