LED Chip Compensation Layer for Reverse Voltage

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Solution Overview

Problem

Conventional LED chips exhibit low reverse voltage due to defect energy levels in the active layer, allowing electrons to easily move from the P-type to the N-type semiconductor layer when a small reverse current is applied, which is undesirable.

Innovation Solution

The LED chip design includes a substrate with a patterning structure, a buffer layer, an N-type semiconductor layer, a compensation layer made of undoped AlxGa1-xN, an active layer, a confinement layer, and a P-type semiconductor layer, where the compensation layer acts as a higher energy barrier to prevent electron movement, reducing lattice mismatch and enhancing reverse voltage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional LED chip structure without compensation layer is used, then the manufacturing process is simpler, but the reverse voltage is low due to defect energy levels allowing easy electron movement

Engineering Contradiction:
Improvereverse voltageVSAvoidlayer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The compensation layer acts as an intermediary barrier between the N-type and P-type semiconductor layers. It introduces a higher energy barrier that prevents direct electron movement through defect energy levels in the active layer, thereby increasing reverse voltage without fundamentally changing the basic LED structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The compensation layer is formed using a composite material composition (typically AlGaN with specific aluminum content) that creates a higher energy barrier compared to the surrounding layers. This composite approach allows tuning of the energy barrier height to optimize reverse voltage while maintaining structural integrity

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If the active layer has defect energy levels, then the manufacturing process is easier, but electrons can easily move from P-type to N-type layer under reverse current

Engineering Contradiction:
Improveactive layer formationVSAvoidreverse voltage
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The compensation layer serves as a mediator that blocks the harmful effect of defect energy levels in the active layer. Even though defects remain in the active layer for ease of manufacturing, the compensation layer prevents electrons from utilizing these defects for easy movement under reverse bias

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The compensation layer extracts or removes the harmful effect of defect energy levels by introducing a higher energy barrier that isolates the active layer defects from influencing electron transport under reverse bias conditions

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The compensation layer effectively increases the reverse voltage of the LED chip, improving its quality and performance by preventing electron flow at small reverse currents, resulting in a higher reverse voltage compared to chips without this structure.

Implementation Method 1

a compensation layer made of undoped AlxGa1-xN, an active layer, a confinement layer and a P-type semiconductor layer arranged on the substrate in sequence, where the compensation layer acts as a higher energy barrier

Methodology Applied
Scientific EffectEnergy barrier: Potential Well

Data Source

PatentUS9105763B2Light emitting diode chip and manufacturing method thereof
Publication Date: 2015.08.11 ADVANCED OPTOELECTRONIC TECH INC
  • US9105763B2 patent drawing
  • US9105763B2 patent drawing
  • US9105763B2 patent drawing

AI summary

A light emitting diode (LED) chip includes an N-type semiconductor layer, a compensation layer arranged on the N-type semiconductor layer, an active layer arranged on the compensation layer; and a P-type semiconductor layer arranged on the active layer. During growth of the compensation layer, atoms of an element (i.e., Al) of the compensation layer move to fill epitaxial defects in the N-type semiconductor layer, wherein the epitaxial defects are formed due to lattice mismatch when growing the N-type semiconductor. A method for manufacturing the chip is also disclosed. The compensation layer is made of a compound having a composition of AlxGa1-xN.