LED Alignment via Reflective Coating Openings
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process of Mini LEDs and micro LEDs faces challenges due to expansion and contraction of circuit boards, leading to misalignment and poor soldering of LEDs on pads, resulting in inadequate electrical connection and reduced yield rates in display devices.
Innovation Solution
The design includes a reflective coating with larger openings than the LEDs to accommodate expansion and contraction, ensuring proper alignment and soldering, and a protective layer with a refractive index greater than the transparent substrate to improve light distribution and reduce uneven brightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the opening size in the reflective coating is made equal to the LED size for precise alignment, then the alignment precision is improved, but the soldering reliability deteriorates due to circuit board expansion and contraction
Solution Approach 1:
The patent changes the parameter of opening size from being equal to LED size to being larger than LED size. This parameter modification allows the opening to accommodate both the LED and the thermal expansion/contraction of the circuit board, thereby maintaining soldering reliability while ensuring proper LED placement
Solution Approach 2:
The patent applies beforehand cushioning by designing the opening with excess size capacity before the expansion and contraction occurs. This pre-designed tolerance buffer absorbs the dimensional changes during manufacturing and operation, preventing misalignment and soldering failures
2Reliability
If the opening size is increased to accommodate expansion and contraction, then the soldering reliability is improved, but the alignment precision deteriorates
Solution Approach 1:
The patent modifies the opening size parameter to be larger than the LED size, creating a tolerance zone that accommodates circuit board expansion and contraction while still maintaining sufficient alignment precision for successful soldering
3Illumination intensity
If the refractive index of the protective layer is made equal to the transparent substrate for uniform light distribution, then the light uniformity is improved, but the light extraction efficiency deteriorates
Solution Approach 1:
The patent applies local quality by creating a refractive index gradient where the protective layer has a higher refractive index than the transparent substrate. This local differentiation optimizes light extraction at the interface while the overall structure maintains uniform light distribution across the display surface
Solution Approach 2:
The patent changes the refractive index parameter of the protective layer to be higher than that of the transparent substrate. This parameter modification enhances light extraction efficiency by reducing total internal reflection at the interface, while the structural design maintains uniform light distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable electrical connection and improved soldering of Mini LEDs, enhancing the yield rate and achieving uniform light distribution across the display panel, thereby improving image contrast and brightness.
Implementation Method 1
a reflective coating, configured to cover the circuit board
Implementation Method 2
a protective layer with a refractive index greater than the transparent substrate to improve light distribution
Data Source
AI summary
Disclosed in the present application is a display apparatus, including a backlight module and a display panel. The backlight module includes a light emitting diode. The display panel, disposed on a light emitting side of the backlight module, and configured to image display; wherein the backlight module comprises a LED board with one or more LEDs; and the LED board includes: a circuit board configured to provide power, and comprising a plurality of pads for soldering the one or more LEDs; a reflective coating, configured to cover the circuit board, and comprising a plurality of openings for exposing the plurality of pads; and the one or more LEDs, configured to be soldered on the plurality of pads in the plurality of openings.