Light Emitting Device Anisotropic Conductive Adhesive Mounting
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Solution Overview
Problem
Conventional light emitting devices require high-temperature substrates for mounting semiconductor light emitting elements, limiting substrate material options and potentially causing deformation, which affects light distribution and brightness.
Innovation Solution
A light emitting device using an LED chip with a phosphor layer bonded to a substrate via an anisotropic conductive adhesive material, allowing for low-temperature mounting and featuring a guide mechanism to prevent phosphor layer deformation during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder or high-temperature adhesive is used for mounting the light emitting element, then strong bonding strength is achieved, but the substrate material options are limited and deformation may occur
Solution Approach 1:
The invention changes the temperature parameter of the bonding process by using a low-temperature curable adhesive instead of high-temperature solder. The adhesive cures at temperatures below 150°C, which expands substrate material options to include flexible substrates and temperature-sensitive materials that would deform or melt at soldering temperatures.
Solution Approach 2:
The invention replaces the mechanical/thermal bonding system (soldering requiring high temperature and pressure) with a chemical bonding system (adhesive that cures at low temperature through chemical reaction). This substitution eliminates the need for high-temperature processing while maintaining bonding strength.
2Manufacturing precision
If the light emitting element is held by suction during mounting, then positioning is achieved, but deformation of the light emitting element may occur
Solution Approach 1:
The invention applies preliminary anti-action by using a guide mechanism that prevents deformation before the adhesive fully cures. The guide structure counteracts the deforming force caused by suction holding, ensuring the light emitting element maintains its proper shape and position throughout the bonding process.
Solution Approach 2:
The guide mechanism acts as an intermediary between the suction holding system and the light emitting element. It mediates the interaction by providing mechanical support and constraint, preventing the suction force from causing deformation while still allowing accurate positioning to be achieved.
3Reliability
If high temperature mounting is used, then reliable bonding is achieved, but substrate material selection is restricted
Solution Approach 1:
The invention changes the temperature parameter from high-temperature soldering (>200°C) to low-temperature adhesive curing (<150°C). This parameter change maintains bonding reliability through the chemical curing process while expanding substrate material options to include temperature-sensitive materials.
Solution Approach 2:
The invention uses a disposable adhesive layer instead of reusable solder joints. The adhesive provides sufficient bonding reliability for the application while being simpler to apply and cure at lower temperatures, sacrificing the reworkability of solder joints for easier, lower-temperature processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures high reliability and light extraction efficiency while preventing deformation and uneven light distribution, enabling the use of a broader range of substrate materials and improving brightness.
Implementation Method 1
the adhesive material is an anisotropic conductive material
Implementation Method 2
bonded by an adhesive material
Implementation Method 3
a phosphor layer provided on a light emitting side of the LED chip
Data Source
AI summary
Disclosed is a light emitting device including: a light emitting element including an LED chip and a phosphor layer provided at the light emitting side of the LED chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic conductive material.