Light Emitting Device Anti-Adhesion Surface
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Solution Overview
Problem
Conventional light emitting devices with smooth upper surfaces tend to adhere to each other, making handling and inspection difficult due to their sticky nature, which can lead to clogging of measurement equipment during light emission testing.
Innovation Solution
The manufacturing method involves creating a light emitting device with a package having a recess and a sealing resin that fills the recess, where the surrounding surface area of the recess features a projection with a rough surface section on its upper surface, preventing the devices from adhering to one another by adjusting the sealing resin to match the package height and forming the rough surface section through cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the upper surface of the light emitting device is made smooth, then the manufacturing process is simple, but the devices easily adhere to one another, making handling difficult
Solution Approach 1:
The invention applies local quality by creating a rough surface section only on the upper surface of the sealing resin, while other surfaces remain smooth. This localized roughness prevents adhesion between devices during handling without complicating the overall manufacturing process. The rough surface is formed by a specific cutting method that creates micro-irregularities only where needed for anti-adhesion purposes.
2Productivity
If multiple light emitting devices are handled in groups, then productivity is improved, but the smooth surfaces cause them to stick together, clogging measurement equipment during inspection
Solution Approach 1:
The invention applies preliminary action by forming the rough surface section on the sealing resin before the devices are packaged and handled in groups. This pre-formed rough surface prevents adhesion from occurring in the first place during batch handling and inspection processes. The cutting step that creates the rough surface is performed while devices are still accessible, preventing subsequent sticking issues during productivity-critical operations.
Data Source
AI summary
A method for manufacturing a light emitting device comprises a package preparation step of preparing a package having a recess in which a light emitting element is locatable, wherein the package includes a projection extending from an upper surface of the package, the projection at least partially surrounding the recess, a sealing resin forming step of filling said recess in which said light emitting element is located with a sealing resin, and providing said sealing resin higher than the height of said package, and a sealing resin cutting step of cutting the sealing resin such that an upper surface of the sealing resin is at a height that is substantially the same as a height of the upper surface of the package.