Light Emitting Apparatus Thermal Conduction via Insulating Layer
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Solution Overview
Problem
Conventional light emitting devices face challenges with heat dissipation due to poor thermal conductivity of the insulating layer and the use of thermal conductive adhesives, which affects efficiency and reliability.
Innovation Solution
A light emitting apparatus with a substrate and a first metal layer, where the insulating layer is formed on the metal layer with superior thermal conductivity, allowing direct heat dissipation through the substrate or metal layer, eliminating the need for thermal conductive adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal conductive adhesive is used to connect the insulating layer to the substrate, then the insulating layer can be securely attached, but the thermal resistance increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The patent removes the thermal conductive adhesive layer from the structure, eliminating the thermal resistance barrier it creates. The insulating layer is directly connected to the substrate without adhesive, allowing heat to flow directly from the light emitting device through the insulating layer to the substrate without passing through the adhesive's thermal resistance.
Solution Approach 2:
The patent employs a composite structure where the insulating layer itself serves dual functions: providing electrical insulation and serving as the thermal conduction path to the substrate. This eliminates the need for a separate adhesive layer and optimizes the thermal pathway by using materials with appropriate thermal conductivity properties in the insulating layer.
2Reliability
If the insulating layer is made with poor thermal conductivity to ensure electrical insulation, then electrical isolation is achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent applies the principle of local quality by designing the insulating layer with spatially varying thermal conductivity. The region beneath the light emitting device has higher thermal conductivity to facilitate heat dissipation, while other regions maintain adequate electrical insulation properties. This allows different parts of the insulating layer to optimize for their specific functions.
Solution Approach 2:
The insulating layer is constructed as a composite material structure that combines materials with different thermal and electrical properties in specific configurations, allowing simultaneous optimization of both electrical insulation and thermal conduction pathways in different regions of the layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhanced heat dissipation efficiency and improved product reliability by utilizing high thermal conductivity materials for the metal and insulating layers, reducing the impact of adhesive degradation.
Implementation Method 1
the heat generated by the light emitting device can be dissipated through the substrate or the first metal layer
Data Source
AI summary
A light emitting apparatus includes a substrate, a first metal layer, an insulating layer and at least one light emitting device. The first metal layer is disposed on the substrate. The insulating layer is disposed on the first metal layer. The light emitting device is disposed on the insulating layer.