LED Array Substrate Adhesive Stacking for Transposition Alignment
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Solution Overview
Problem
The accumulation of offset during multiple transpositions of light emitting diode elements in the manufacturing process of a display panel leads to a decrease in bonding yield, which is a challenge in the production of light emitting diode display panels.
Innovation Solution
A manufacturing method for a light emitting element array substrate that involves using multiple adhesive structures with stacked adhesive members to minimize the offset of light emitting elements during transposition, utilizing temporary storage bases and adhesive layers to align and bond the elements efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If light emitting diode elements are transposed multiple times during manufacturing, then the light emitting diode display panel can be assembled, but the overall offset of the light emitting diode elements accumulates and bonding yield decreases
Solution Approach 1:
The adhesive structure is divided into multiple adhesive members (first adhesive member, second adhesive member, third adhesive member) that are applied at different stages during the transposition process. Each adhesive member is responsible for a specific bonding stage, which segments the overall bonding process into manageable steps and reduces cumulative offset at each stage.
Solution Approach 2:
The first adhesive member is applied to the light emitting diode element before the first transposition operation. This preliminary application of adhesive ensures proper positioning during the initial transposition and prevents offset accumulation from occurring during subsequent handling and bonding steps.
2Reliability
If multiple adhesive members are stacked in adhesive structures, then offset is reduced and bonding yield improves, but device complexity increases
Solution Approach 1:
Multiple adhesive members are vertically stacked and combined into a single integrated adhesive structure located at the same position on the light emitting diode element. This merging approach consolidates multiple bonding functions into one unified structure, reducing the number of separate components and simplifying the overall device architecture while maintaining the benefits of multi-stage bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly reduces the overall offset of light emitting elements, thereby improving the bonding yield and transposition speed, enhancing the manufacturing efficiency of light emitting diode display panels.
Implementation Method 1
Each of the adhesive structures includes a first adhesive member and a second adhesive member stacked on each other
Data Source
AI summary
A light emitting element array substrate includes a temporary storage base, light emitting elements, and adhesive structures. The light emitting elements are disposed on the temporary storage base. The adhesive structures are respectively located on the light emitting elements. Each of the adhesive structures includes a first adhesive member and a second adhesive member stacked on the first adhesive member. In addition, a manufacturing method of the light emitting element array substrate is also provided.