LED Array with Chip-on-Board Mounting and Primary Lenses
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Solution Overview
Problem
Conventional LED packages are limited in power input and suffer from inefficiencies due to optical losses and heat retention issues, making it difficult to achieve high luminous flux levels in a compact form factor, especially when trying to produce directed or collimated light output.
Innovation Solution
The use of a circuit board with die attach pads for chip-on-board mounting of LED chips, combined with primary lenses directly over each chip or sub-group of chips, and a heat sink for efficient thermal management, maximizing first pass light extraction and minimizing thermal cross-talk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional LED packages are used to increase power input for higher luminous flux, then light output increases, but optical losses and heat retention worsen
Solution Approach 1:
The patent segments the LED array into multiple individual LED chips mounted on a common substrate, each with its own optical path. This segmentation allows light from each chip to be extracted independently before combining, reducing cumulative optical losses that would occur in a single high-power LED package while maintaining high total luminous flux output.
2Power
If conventional LED packages are used to increase power input for higher luminous flux, then light output increases, but heat retention worsens
Solution Approach 1:
The patent divides the high-power LED system into multiple lower-power individual LED chips distributed across a substrate. This segmentation distributes the heat generation across multiple smaller sources, improving thermal management by reducing heat concentration at any single point and facilitating more effective heat dissipation through the substrate and mounting structure.
3Volume of moving object
If a compact form factor is used, then device size decreases, but light extraction efficiency worsens
Solution Approach 1:
The patent arranges multiple LED chips in a two-dimensional array on a flat substrate, utilizing the planar dimension to achieve compact form factor while maintaining effective light extraction paths. The substrate acts as a light-guiding structure that directs light from each chip toward the output surface, ensuring efficient extraction despite the compact two-dimensional configuration.
4Shape
If directed or collimated light output is achieved, then beam quality improves, but optical losses increase
Solution Approach 1:
The patent uses multiple individual LED chips, each contributing to the overall beam formation. This segmented approach allows for distributed beam shaping where each chip's light can be individually optimized, reducing the optical losses that would occur in a single high-power system requiring aggressive beam shaping. The collective output from multiple chips achieves the desired directed or collimated beam quality with reduced per-chip optical losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in compact, efficient solid state lighting components with improved light extraction efficiency and thermal management, enabling higher luminous flux levels while maintaining a compact form factor, suitable for various lighting applications.
Implementation Method 1
Light emitting diodes (LED or LEDs) are solid state devices that convert electric energy to light, and generally comprise one or more active layers of semiconductor material sandwiched between oppositely doped layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light.
Implementation Method 2
The reflective cup 13 may be filled with an encapsulant material 16 which may contain a wavelength conversion material such as a phosphor. Light emitted by the LED at a first wavelength may be absorbed by the phosphor, which may responsively emit light at a second wavelength.
Implementation Method 3
a heat sink for efficient thermal management, maximizing first pass light extraction and minimizing thermal cross-talk
Data Source
AI summary
A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.