Close-packed LED Array with Conductive Rods for Thermal Management
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Solution Overview
Problem
Conventional light-emitting diode (LED) arrays face inefficiencies in heat dissipation, leading to temperature increases and potential failure when densely packed, which is exacerbated by the need for larger and more power-intensive heat sinks to manage heat.
Innovation Solution
A close-packed array of LEDs is designed with a nonconductive substrate featuring elongate channels containing conductive rods for both thermal and electrical conductivity, allowing for effective anisotropic heat dissipation and efficient light production without increasing device size or power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are used to reduce chip temperature, then temperature is reduced, but device size and power usage increase
Solution Approach 1:
The heat dissipation function is segmented into multiple discrete conductive rods distributed across the substrate, rather than using a single large heat sink. Each rod independently conducts heat away from nearby LEDs, enabling distributed thermal management that reduces the need for large centralized heat dissipation structures.
Solution Approach 2:
The conductive rods serve multiple functions simultaneously: they provide thermal conduction to dissipate heat from LEDs, electrical conduction to supply power to LEDs, and structural support for mounting LEDs. This multi-functionality eliminates the need for separate heat sink structures, reducing overall device size.
2Temperature
If spacing between LEDs is increased to reduce temperature, then temperature is reduced, but light intensity and device density decrease
Solution Approach 1:
The substrate is segmented into multiple regions with conductive rods distributed throughout, allowing LEDs to be densely packed while each LED has access to nearby thermal conduction pathways. This segmentation enables high LED density without compromising individual LED thermal management.
Solution Approach 2:
Heat dissipation is extended into the vertical dimension through conductive rods that conduct heat from the LED junction through the substrate thickness. This three-dimensional heat management approach allows dense two-dimensional LED packing while maintaining effective thermal conduction paths.
3Productivity
If more LEDs are densely concentrated on the chip, then light intensity increases, but heat generation and failure risk increase
Solution Approach 1:
The thermal management system is segmented into multiple conductive rods distributed across the substrate, with each rod serving a local group of LEDs. This segmentation allows high LED density while maintaining adequate heat dissipation capacity for each LED, preventing thermal runaway and failure.
Solution Approach 2:
Each LED is self-served with dedicated thermal conduction pathways through the conductive rods that are integrated into the substrate structure. The LEDs benefit from passive, distributed thermal management without requiring active cooling systems, improving reliability while maintaining high density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient thermal management and light output from densely packed LEDs, preventing overheating and extending the lifespan of the LED chips while maintaining compact size and low power usage.
Implementation Method 1
each of the elongate channels in at least a portion of the substrate includes a conductive rod therein... efficient thermal management and efficient light production... effective anisotropic heat dissipation
Implementation Method 2
When a diode is forward biased, charge carriers, including electrons and holes, flow through the semiconductor between the anode and cathode. When electrons and holes recombine, they release energy in the form of a photon.
Data Source
AI summary
A close-packed array of light emitting diodes includes a nonconductive substrate having a plurality of elongate channels extending therethrough from a first side to a second side, where each of the elongate channels in at least a portion of the substrate includes a conductive rod therein. The conductive rods have a density over the substrate of at least about 1,000 rods per square centimeter and include first conductive rods and second conductive rods. The close-packed array further includes a plurality of light emitting diodes on the first side of the substrate, where each light emitting diode is in physical contact with at least one first conductive rod and in electrical contact with at least one second conductive rod.