Expandable LED Array Interconnect with Edge Terminals
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Solution Overview
Problem
High-power LED arrays require complex and expensive circuitry for electrical connections, which can obscure light emitters and reduce efficiency, especially as the number of arrays increases, due to the need for circuit elements that cannot be mounted on the surface.
Innovation Solution
The use of substrates with input and output terminals accessible from multiple edges allows for flexible interconnection of LED array elements, enabling serial, parallel, or combined connections, and allows for efficient mounting and heat dissipation, facilitating the expansion of LED arrays on two- or three-dimensional surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LED arrays are grouped together to increase luminous output, then the light intensity increases, but the circuitry becomes complex and expensive
Solution Approach 1:
The patent divides the LED array system into modular units where each substrate contains a simplified circuit configuration. By segmenting the overall array into multiple independent substrates that can be connected in series or parallel, the complexity is distributed and managed at each module level rather than requiring a complex centralized circuit for the entire array.
Solution Approach 2:
The patent utilizes the substrate edges and multiple connection points to create two-dimensional connectivity patterns. By allowing connections along multiple edges of rectangular substrates, the circuit layout can be arranged in various configurations (series, parallel, or combinations) without increasing circuit element complexity, effectively using spatial arrangement to manage circuit complexity.
2Illumination intensity
If circuit elements are added to power multiple LED arrays, then the luminous output increases, but the circuit elements obscure the light emitters and reduce efficiency
Solution Approach 1:
The patent extracts the circuit elements from the light-emitting surface area by placing them along the substrate edges. This separation allows the LED emitters to occupy the central substrate area unobstructed, while the necessary circuitry is positioned at the periphery where it does not block light emission, thus maintaining high light efficiency while still enabling multiple arrays to be powered.
Solution Approach 2:
The patent applies different functional qualities to different regions of the substrate: the central area is dedicated to light-emitting LED elements with no obstructions, while the edge regions are designated for circuit elements. This spatial differentiation ensures that each region performs its intended function optimally without interfering with the other.
3Illumination intensity
If the number of LED arrays is increased, then the luminous output increases, but the circuit topology requires elements that cannot be mounted on the surface
Solution Approach 1:
The patent transitions from planar circuit layouts to three-dimensional edge-based connectivity. By utilizing the vertical and lateral edges of rectangular substrates, the invention enables series and parallel connections without requiring additional surface-mounted circuit elements, thus maintaining ease of manufacture while supporting increased array complexity.
Solution Approach 2:
The substrate edges serve multiple functions: they provide structural boundaries, thermal management pathways, and electrical connection interfaces. This multi-functionality allows the same substrate structure to support increased array complexity without requiring additional specialized components, maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the flexibility and efficiency of LED array designs, increasing luminescent output while reducing the complexity and cost of circuitry, allowing for improved light distribution and thermal management.
Implementation Method 1
LEDs are semiconductor photon sources that can serve as highly efficient electronic-to-photonic transducers. They are typically forward-biased p-n junctions fabricated from a semiconductor material that emit light via injection electroluminescence.
Implementation Method 2
efficient mounting and heat dissipation
Data Source
AI summary
A light emitting device that can function as an array element in an expandable array of such devices. The light emitting device comprises a substrate that has a top surface and a plurality of edges. Input and output terminals are mounted to the top surface of the substrate. Both terminals comprise a plurality of contact pads disposed proximate to the edges of the substrate, allowing for easy access to both terminals from multiple edges of the substrate. A lighting element is mounted to the top surface of the substrate. The lighting element is connected between the input and output terminals. The contact pads provide multiple access points to the terminals which allow for greater flexibility in design when the devices are used as array elements in an expandable array.