LED Array Assembly Grooved Secondary Substrate Thermal Transfer

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current LED array manufacturing processes are time-consuming and prone to failure, leading to high likelihood of individual LED chip defects which can cause entire arrays to be scrapped, increasing manufacturing costs and reducing reliability.

Innovation Solution

The development of high-powered LED array assemblies with a unique construction that integrates multiple LEDs on a single primary substrate, secured to a secondary substrate with grooves and raised contact portions, allowing for efficient thermal transfer and electrical connectivity, and enabling individual LED packages to be easily separated for testing and reuse.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If LED chips are individually attached on a substrate with a printed circuit board that is then attached to a separate heat sink, then the manufacturing process can be completed, but the process is time-consuming and increases the likelihood of failure

Engineering Contradiction:

Improvemanufacturing process completionVSAvoidtime-consuming process

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The patent combines the substrate and heat sink into a single integrated unit. The substrate is directly formed with heat dissipation structures (heat sinks) as an integral part, eliminating the need for separate attachment processes. This merging of components reduces manufacturing steps, decreases processing time, and minimizes the number of potential failure points associated with multiple assembly operations.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

Engineering Contradiction:

Improvemanufacturing process completionVSAvoidlikelihood of failure

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

By integrating the heat sink directly into the substrate structure, the patent eliminates multiple attachment interfaces that could fail. The single integrated structure reduces the number of potential failure points, improving overall reliability while maintaining ease of manufacture through reduced assembly complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated design anticipates potential failure points by eliminating separate attachment interfaces before manufacturing begins. By pre-designing the substrate with built-in heat dissipation capabilities, the system cushions against potential failures that would occur at attachment points in traditional separate-component designs.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If individual LED chips are placed separately on the arrays, then each chip can be positioned in its appropriate position, but the individual chips cannot be independently checked after removal from the wafer and placement within the array

Engineering Contradiction:

Improvechip positioningVSAvoidindividual chip failure detection

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent enables preliminary testing of LED chips before they are permanently integrated into the array. By maintaining the ability to separate and independently test individual chips after mounting on the substrate, quality control can be performed beforehand, allowing defective chips to be identified and replaced before final array assembly, thus improving reliability.

Inventive Principle:

Principle #10Preliminary action

4Illumination intensity

If as many as 16, 32 or 64 LEDs are placed in the array, then the light output level increases, but a single bad LED can cause the whole array to be scrapped or discarded

Engineering Contradiction:

Improvelight output levelVSAvoidarray scrappage due to single defect

Core Design Contradiction:

Illumination intensityVSReliability

Solution Approach 1:

The patent structures the LED array with independently testable and replaceable chip units on the substrate. This segmentation allows individual LEDs to be tested and identified separately, so that if one LED is defective, only that specific chip needs to be replaced rather than scrapping the entire array. This maintains high illumination intensity while improving reliability through modular defect management.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the reliability and durability of LED arrays by simplifying the manufacturing process, reducing the risk of failure, and allowing for efficient heat dissipation and electrical connection, while enabling pre-testing and reuse of individual LEDs, thus lowering manufacturing costs.

Implementation Method 1

secured to a secondary substrate with grooves and raised contact portions, allowing for efficient thermal transfer and electrical connectivity

Methodology Applied

Scientific EffectThermal transfer: Conduction (thermal)

Implementation Method 2

secured to a secondary substrate with grooves and raised contact portions, allowing for efficient thermal transfer and electrical connectivity

Methodology Applied

Scientific EffectElectrical connection: Conduction (electrical)

Data Source

PatentUS9048392B2Light emitting device array assemblies and related methods

Publication Date: 2015.06.02 CREELED INC

AI summary

Light emitting device (LED) array assemblies and related methods are provided. An LED array assembly can include a primary substrate with an array of light emitting devices disposed on the primary substrate. The LED array assembly can also include a secondary substrate comprising at least one or more grooves. The primary substrate can be positioned on the secondary substrate with the grooves facing the primary substrate.