LED Array Heating for Semiconductor Substrate Alignment
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Solution Overview
Problem
The existing semiconductor fabrication processes are hindered by the need for dedicated preheating stations, which reduce throughput, increase complexity and cost, and congest the processing chamber, as substrates must be heated separately before processing, adding time and space requirements.
Innovation Solution
An array of light-emitting diodes (LEDs) is integrated above the alignment station to heat substrates during the alignment process, utilizing wavelengths readily absorbed by silicon to achieve efficient and uniform heating, thereby eliminating the need for preheating stations and optimizing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a dedicated preheating station is used to heat substrates, then substrate temperature is improved, but processing time and throughput are worsened
Solution Approach 1:
The patent combines the preheating function with the alignment station by integrating a heating element into the alignment station. This allows substrates to be heated during the alignment process, merging two previously separate operations (alignment and preheating) into one simultaneous process, thereby eliminating the need for a dedicated preheating station and reducing total processing time
Solution Approach 2:
The alignment station is transformed into a multi-functional device that performs both alignment and preheating operations. The heating element integrated into the alignment station enables it to serve dual purposes: orienting substrates and heating them to the required temperature, thus eliminating the need for separate dedicated preheating equipment
2Temperature
If a dedicated preheating station is added to the processing chamber, then substrate heating capability is improved, but device complexity and cost are worsened
Solution Approach 1:
The patent merges the preheating function with the existing alignment station by integrating a heating element into it. This consolidation eliminates the need for a separate dedicated preheating station, thereby reducing system complexity and cost while maintaining the required substrate heating capability
Solution Approach 2:
The alignment station is enhanced to perform multiple functions: substrate alignment and substrate preheating. This multi-functional approach eliminates the need for additional dedicated preheating equipment, simplifying the overall system architecture and reducing costs
3Temperature
If a dedicated preheating station is placed within reach of the substrate handling robot, then substrate heating is improved, but processing chamber congestion is worsened
Solution Approach 1:
The patent integrates the heating function into the existing alignment station, which is already positioned within the processing chamber's operational space. This eliminates the need for a separate dedicated preheating station that would require additional space, thereby avoiding processing chamber congestion while maintaining effective substrate heating capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for simultaneous alignment and heating of substrates, reducing processing time, eliminating the need for preheating stations, and simplifying the processing chamber layout, thereby enhancing throughput and reducing costs and complexity.
Implementation Method 1
The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate
Data Source
AI summary
A system for heating substrates while being transported between the load lock and the platen is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed above the alignment station. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LEDs may be arranged so that the rotation of the substrate during alignment results in a uniform temperature profile of the substrate. Further, heating during alignment may also increase throughput and eliminate preheating stations that are currently associated with the processing chamber.