LED Array Insulating Trenches Reduce ESD Field Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Light emitting devices are prone to electrostatic discharge (ESD) damage due to high electric field strengths between serially-connected LED cells, which can lead to damage and failure when exposed to external electrostatic fields.
Innovation Solution
The implementation of insulating layers and structures, such as trenches and insulating walls, between LED cells to reduce electrical field strength, combined with design modifications like changing connecting directions and increasing distances between cells, and the use of conductive lines to manage potential differences, helps prevent ESD damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If LED cells are connected in series with short distance between them, then the device complexity is reduced and manufacturing is simplified, but the electric field strength becomes excessively high causing ESD damage
Solution Approach 1:
An insulating wall is introduced as an intermediary structure between adjacent LED cells. This insulating wall physically separates the cells while maintaining electrical connection through conducting metals, thereby reducing the electric field strength between cells without increasing overall device complexity or manufacturing difficulty
Solution Approach 2:
The insulating structure is applied locally only between adjacent LED cells where high electric field strength occurs, rather than throughout the entire device. This localized approach reduces ESD damage risk at critical interfaces while maintaining simplicity in other regions
2Object-affected harmful factors
If the distance between LED cells is increased to reduce electric field strength, then ESD protection is improved, but the device area increases and manufacturing precision requirements change
Solution Approach 1:
Instead of increasing horizontal distance between LED cells, the solution introduces a vertical dimension by adding insulating walls and multi-layer conducting metal structures. This three-dimensional arrangement reduces electric field strength through increased separation paths without significantly increasing the device footprint
3Object-affected harmful factors
If insulating structures are added between LED cells to reduce electric field strength, then ESD protection is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The insulating wall structure is merged with the existing conducting metal layers and LED cell arrangement. The insulating wall serves multiple functions: electrical insulation, mechanical support, and structural organization, thereby reducing overall manufacturing complexity despite adding ESD protection functionality
4Reliability
If conducting metals are used to connect LED cells in series, then electrical connectivity is achieved, but high current density causes heating and potential damage
Solution Approach 1:
The conducting metal connection path is segmented into multiple sections with insulating walls between them. This segmentation distributes the current flow across multiple pathways and reduces current density at any single point, thereby reducing heating while maintaining overall electrical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These measures effectively protect light emitting devices from ESD by reducing electrical field strengths and directing current flow, thereby minimizing damage and ensuring device functionality.
Implementation Method 1
The implementation of insulating layers and structures, such as trenches and insulating walls, between LED cells to reduce electrical field strength
Implementation Method 2
a plurality of conducting metals formed on the LED cells to electrically connect the plurality of LED cell in series
Data Source
AI summary
The present disclosure provides a light emitting device including an LED array including a plurality of LED cells connected in series disposed on a single substrate; wherein each LED cell includes a first edge, a second edge, a third edge, and a fourth edge, and wherein the LED array includes a first LED and a second LED, the first edge of the first LED is adjacent to the third edge of the second LED; a first trench, disposed between the first LED cell and the second LED; and a first conducting metal, disposed on the first trench, the first edge of the first LED and the third edge of the second LED, and electrically connecting the first LED and the second LED in series; wherein the first LED and/or the second LED includes a round corner in a top view.


