LED Array Member With Integrated Control Module and Switching Converter

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Solution Overview

Problem

Packaging of LED arrays for luminaires poses challenges in heat management and power supply, as existing solutions fail to efficiently regulate temperature and power distribution, leading to potential performance degradation and failure.

Innovation Solution

An integrated control module (ICM) and LED array member (LAM) assembly that includes a washer-shaped molded plastic ICM with embedded circuitry for thermal contact, power supply, and communication, utilizing a switching converter to regulate current or voltage and monitor temperature, current, and voltage, ensuring efficient heat dissipation and power management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If LED array is fixed to heat sink with multiple screws/bolts, then heat dissipation is improved, but device complexity and assembly difficulty increase

Engineering Contradiction:

Improveheat dissipationVSAvoidassembly complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the mounting function and thermal contact function into a single integrated LED array member with an extended rear surface that directly contacts the heat sink. This eliminates the need for separate screws and thermal paste, reducing assembly complexity while maintaining effective heat dissipation through the integrated thermal path.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The extended rear surface of the LED array member serves multiple functions simultaneously: it provides mechanical support for mounting, ensures thermal contact with the heat sink, and distributes heat across a larger surface area. This multi-functional design reduces the number of separate components needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Illumination intensity

If LED array operates at high power, then illumination intensity is improved, but heat generation increases causing performance degradation

Engineering Contradiction:

Improvelight outputVSAvoidoperating temperature

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by high-power LED operation into a beneficial thermal management opportunity by providing direct contact with a heat sink through the extended rear surface. The heat that would otherwise degrade performance is efficiently conducted away, enabling sustained high-power operation with stable light output.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Adaptability or versatility

If multiple separate components are used for mounting and thermal contact, then adaptability is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvemounting flexibilityVSAvoidalignment precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent segments the LED array construction into a modular array member with an integrated extended rear surface that serves as both mounting interface and thermal contact surface. This segmentation allows the array member to be manufactured as a single precision component with built-in alignment features, reducing the need for field alignment while maintaining adaptability through standardized mounting interfaces.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively manages heat and power distribution, enhancing the reliability and performance of LED arrays by maintaining optimal operating conditions and allowing for remote monitoring and control, thus preventing performance degradation and failure.

Implementation Method 1

a switching converter to regulate current or voltage

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

the LED array is typically fixed in some way to a heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

Light emitted from the LED chips is absorbed by the phosphor particles, and is re-emitted by the phosphor particles so that the re-emitted light has a wider band of wavelengths

Methodology Applied

Scientific EffectPhotoluminescence: Photoluminescence

Data Source

PatentUS9730284B2LED array member and integrated control module assembly with built-in switching converter

Publication Date: 2017.08.08 SIGNIFY HOLDING BV

AI summary

A LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a built-in switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.