LED Array Layout for Compact Color Mixing

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Solution Overview

Problem

Existing LED packages face challenges in producing high-quality, compact solid state lighting with efficient color mixing, leading to issues like visible discrete sources, optical losses, and limited power output due to the need for minimum spacing between diffusers and light sources, which restricts the development of low-profile fixtures and high-lumen output.

Innovation Solution

The arrangement of LED chips in an array on a submount with specific guidelines, such as no direct adjacency of certain groups, minimal edge placement, and adequate adjacency of other color groups, promotes natural color mixing and reduces optical losses, allowing for compact and efficient light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If multiple LED packages are mounted in an array with specular reflectors to produce white light, then light output is improved, but color mixing becomes difficult and discrete color sources remain visible

Engineering Contradiction:
Improvelight outputVSAvoidcolor uniformity
Core Design Contradiction:
Illumination intensityVSStability of the object's composition

Solution Approach 1:

The LED array is segmented into multiple strings with different color compositions. Each string contains a specific ratio of red, green, and blue LEDs, allowing independent control and optimization of color mixing while maintaining high light output from the entire array.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the LED array have different color compositions and characteristics. By varying the red-green-blue LED ratios in different strings and positions, the patent achieves uniform color mixing across the entire array while maintaining high illumination intensity.

Inventive Principle:
Principle #3Local quality

2Length of moving object

If diffusers are placed close to LED chips to enable low-profile fixtures, then device compactness is improved, but minimum spacing requirements cause optical losses

Engineering Contradiction:
Improvefixture profileVSAvoidoptical losses
Core Design Contradiction:
Length of moving objectVSLoss of energy

Solution Approach 1:

The patent replaces mechanical spacing requirements with optical design solutions. By using specific diffuser patterns and LED array configurations, the system achieves effective color mixing and light diffusion without requiring minimum physical spacing between LED chips and diffusers, eliminating optical losses while maintaining low-profile construction.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If LED chips are arranged in traditional patterns, then manufacturing is simplified, but color mixing is insufficient and discrete sources are visible

Engineering Contradiction:
Improvearray fabricationVSAvoidcolor homogeneity
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The LED array is divided into multiple independently controllable strings with specific color ratios. This segmentation allows for systematic manufacturing processes while achieving superior color mixing, as each string can be independently assembled and tested before final integration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs asymmetric LED placement patterns and varying string configurations rather than uniform symmetric arrangements. This asymmetric design optimizes color mixing by ensuring proper spatial distribution of different color LEDs while remaining compatible with standard manufacturing processes.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables effective color mixing in both near and far fields, reducing the visibility of discrete sources and enhancing light output, making it possible to achieve high-lumen levels in a compact form factor while maintaining efficiency.

Implementation Method 1

Light emitting diodes (LED or LEDs) are solid state devices that convert electric energy to light

Methodology Applied
Scientific EffectLight emitting diode (LED): Light Emitting Diode

Implementation Method 2

When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 3

The reflective cup 13 may be filled with an encapsulant material 16 which may contain a wavelength conversion material such as a phosphor. Light emitted by the LED at a first wavelength may be absorbed by the phosphor, which may responsively emit light at a second wavelength

Methodology Applied
Scientific EffectPhosphor wavelength conversion: Photoluminescence

Implementation Method 4

a metal reflector 24 is mounted on the submount 23, surrounds the LED chip(s) 22, and reflects light emitted by the LED chips 22 away from the package 20

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 5

This approach enables effective color mixing in both near and far fields, reducing the visibility of discrete sources and enhancing light output

Methodology Applied
Scientific EffectLight scattering and diffusion: Scattering

Data Source

PatentUS9484329B2Light emitter array layout for color mixing
Publication Date: 2016.11.01 CREELED INC
  • US9484329B2 patent drawing
  • US9484329B2 patent drawing
  • US9484329B2 patent drawing

AI summary

Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.