LED Array Package With Reflective Die Attach for Lumen Recovery

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Solution Overview

Problem

Vertical LEDs experience a 20% lumen drop in LED chip-on-board configurations due to light absorption effects when used as a direct replacement for lateral LEDs, making it difficult to optimize their performance without additional modifications.

Innovation Solution

The use of a translucent substrate and a reflective die attach material surrounding the vertical LEDs in an array design, which reduces light absorption between LEDs, achieving a light output similar to conventional lateral LEDs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If vertical LEDs are used as a drop-in replacement for lateral LEDs in array packages, then the LED configuration is simplified and vertical LED performance advantages are utilized, but light absorption effects between LEDs cause a 20% lumen drop

Engineering Contradiction:
ImproveLED configuration complexityVSAvoidlight output
Core Design Contradiction:
Device complexityVSIllumination intensity

Solution Approach 1:

A reflective adhesive material is introduced as an intermediary substance between adjacent vertical LEDs in the array. This reflective material redirects light that would otherwise be absorbed by neighboring LEDs back toward the desired emission direction, thereby maintaining high light output while preserving the simplified vertical LED configuration.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If vertical LEDs are used without additional optimization, then the manufacturing process is simplified, but light absorption effects reduce light output by 20%

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidlight output
Core Design Contradiction:
Ease of manufactureVSIllumination intensity

Solution Approach 1:

The optical properties of the adhesive material are changed from conventional non-reflective formulations to specifically reflective formulations. This parameter change in the adhesive material's reflectivity enables the system to maintain high light output while keeping the manufacturing process relatively simple, as the same basic assembly steps are used but with a modified material property.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If conventional die attach material is used with vertical LEDs, then the manufacturing process is straightforward, but light absorption between LEDs reduces overall lumens

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidlight energy absorption
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The adhesive material is designed with reflective properties that convert the potentially harmful light absorption effect into a beneficial reflection effect. Light that would normally be absorbed by adjacent LEDs is instead reflected back into the emission path, turning what was previously a loss mechanism into a light-enhancing mechanism while maintaining straightforward manufacturing.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The combination of a translucent substrate and reflective die attach material increases light output by 10-20% lumens, effectively addressing the absorption issues and making vertical LEDs a suitable replacement for lateral LEDs in chip-on-board configurations.

Implementation Method 1

a reflective die attach material extending along the one or more side walls of the light emitting die

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

The light emitting die includes a translucent carrier substrate

Methodology Applied
Scientific EffectLight transmission:

Data Source

PatentUS11764341B2LED array package
Publication Date: 2023.09.19 BRIDGELUX INC
  • US11764341B2 patent drawing
  • US11764341B2 patent drawing
  • US11764341B2 patent drawing

AI summary

Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.