LED Array Micro-Displays for Large Screens via Sub-Display Segmentation
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Solution Overview
Problem
Current LED array displays face manufacturing complexity and size limitations due to standard semiconductor integrated circuit wafer dimensions, restricting the size of displays that can be fabricated.
Innovation Solution
The development of larger displays formed by multiple sub-displays, where each sub-display includes an array of light-emitting pixels on one side of a substrate integrated with control electronics on the other side, connected via conductive electrodes and a conductive grid array package, allowing for the assembly of ultra-high resolution displays with high efficiency and reduced cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If standard semiconductor integrated circuit wafers are used for manufacturing LED array displays, then manufacturing process is established and reliable, but the display size is limited by wafer dimensions
Solution Approach 1:
The display is divided into multiple sub-displays, each fabricated on a separate semiconductor wafer using standard manufacturing processes. These sub-displays are then assembled together to form a larger display system, effectively overcoming the size limitation of individual wafers while maintaining manufacturing reliability
Solution Approach 2:
Multiple sub-displays are integrated within a single display housing or mounting structure, with each sub-display containing complete functional elements (LED arrays, control circuits, drivers). The nested arrangement allows multiple independent display units to cooperate as a unified large-scale display system
2Manufacturing precision
If multiple sub-displays are integrated to form larger displays, then display size and resolution are improved, but interconnection complexity increases
Solution Approach 1:
Each sub-display is designed with universal interfaces and standardized connection protocols, allowing them to function independently or be combined with other identical sub-displays. This multi-functionality simplifies interconnections, as each module can connect to any other module of the same type without requiring custom wiring schemes
Solution Approach 2:
The system allows dynamic reconfiguration of display parameters such as resolution, refresh rate, and content distribution across sub-displays. By changing operational parameters rather than physical connections, the system achieves high resolution and flexibility without proportionally increasing interconnection complexity
3Illumination intensity
If LED arrays are used instead of LCD, then luminance and ambient condition adaptability are improved, but manufacturing complexity increases
Solution Approach 1:
The successful LCD manufacturing process is copied and adapted for LED array fabrication on semiconductor wafers. By using similar wafer-based manufacturing techniques, deposition, and patterning processes, the industry leverages existing manufacturing expertise and infrastructure to produce LED displays, thereby reducing the complexity increase that would otherwise result from entirely new manufacturing methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of ultra-high resolution, energy-efficient, and cost-effective LED displays with larger sizes, overcoming the dimensional limitations of standard silicon wafers, achieving seamless integration of components and low power consumption.
Implementation Method 1
each pixel including at least one light-emitting element
Implementation Method 2
LED arrays are becoming more popular than liquid crystal displays (LCD) as an image source
Implementation Method 3
conductive electrodes penetrating through the substrate and coupling the array of light-emitting pixels on the first side to the integrated circuits on the second side
Data Source
AI summary
Larger displays formed by multiple sub-displays, e.g., integrated light-emitting diode (LED) pixel array micro-displays, and methods of operating and making the larger displays are provided. An example larger display includes a plurality of sub-displays arranged on a display substrate. Each sub-display includes an array of light-emitting pixels formed on a first side of a substrate, each pixel including at least one light-emitting element, integrated circuits formed on a second side of the substrate, conductive electrodes penetrating through the substrate and coupling the array of light-emitting pixels to the integrated circuits, and a conductive grid array package, e.g., a ball grid array (BGA) package, formed on the second side of the substrate and conductively coupled to the integrated circuits. Interconnects are conductively coupled to the conductive grid array packages of the plurality of sub-displays to form the larger display.