LED Array Spacing Layout for High-Precision Mass Transfer
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Solution Overview
Problem
The challenge in the semiconductor industry is to achieve efficient mass transfer of miniaturized LEDs with high precision, high throughput, and low cost, particularly in transferring large numbers of LEDs between different substrates while maintaining precise arrangement and spacing.
Innovation Solution
A semiconductor device arrangement is proposed, comprising a carrier with an adhesive layer, where first and second semiconductor devices are arranged in specific regions with defined distances, allowing for regional laser transfer to a temporary carrier, adjusting spacings to maintain alignment and stability during the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If miniaturized LEDs are transferred in large numbers between substrates, then productivity is improved, but manufacturing precision deteriorates due to difficulty in maintaining precise arrangement and spacing
Solution Approach 1:
The patent divides the LED array into multiple transfer regions (first region and second region) with different spacing characteristics. This segmentation allows different spacing requirements to be satisfied in different regions, enabling high-precision transfer while maintaining high productivity through regional optimization rather than uniform processing.
Solution Approach 2:
The patent implements local quality by setting different spacing distances in different regions: a first distance between adjacent LEDs in the same region, and a second distance between LEDs in adjacent regions. This local differentiation allows each region to be optimized for its specific transfer requirements, maintaining precision while enabling mass transfer.
2Length of moving object
If LEDs are miniaturized to reduce size, then device dimensions are improved, but manufacturing precision deteriorates due to increased difficulty in maintaining spacing accuracy
Solution Approach 1:
The patent applies local quality by implementing different spacing distances in different regions of the LED array. This allows the spacing to be locally optimized for miniaturized LEDs, ensuring that even as LED dimensions are reduced, the spacing precision can be maintained through regional differentiation rather than requiring uniform high-precision control across the entire array.
Solution Approach 2:
The patent changes the spacing parameter from a uniform value to a region-dependent value. By setting the first distance and second distance differently based on regional requirements, the patent enables precise control over LED spacing even as LED dimensions are miniaturized, effectively decoupling device size reduction from precision degradation.
3Ease of manufacture
If uniform spacing is maintained between all LEDs, then manufacturing simplicity is improved, but adaptability deteriorates when different regional spacing requirements arise
Solution Approach 1:
The patent segments the LED array into multiple regions with different spacing configurations. This segmentation provides adaptability to meet different regional spacing requirements while maintaining relatively simple manufacturing processes within each region, avoiding the need for completely complex customized processing for each LED.
Solution Approach 2:
The patent introduces dynamic adaptability by allowing different spacing distances in different regions. This enables the manufacturing process to adapt to varying spacing requirements across the array without requiring complete process redesign, achieving versatility while maintaining ease of manufacture through a systematic regional approach.
Data Source
AI summary
A semiconductor device arrangement includes a carrier, an adhesive layer, several first semiconductor devices, and several second semiconductor devices. The carrier has an upper surface, and the adhesive layer is arranged on the upper surface. The several first semiconductor devices are arranged in a first region on the adhesive layer, the several second semiconductor devices are arranged in a second region on the adhesive layer, and the first region abuts the second region. Wherein, any two adjacent first semiconductor devices of the several first semiconductor devices are separated by a first distance, any one of the several first semiconductor devices and any one of the several second semiconductor devices, which are adjacent to each other, are separated by a second distance, and the first distance is larger than the second distance.