LED Array Package Thermal Plate Heat Dissipation

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Solution Overview

Problem

LED array packages face heat dissipation challenges, with top surface temperatures reaching 200°C or more, which can damage the device and reduce quantum efficiency.

Innovation Solution

A highly thermal conductive plate is attached to the phosphor layer of the LED array package, secured by a thermally conductive attachment member that extends to a heat sink, facilitating effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional LED array packages are used, then the structure is simple and easy to manufacture, but the top surface temperature reaches 200°C or more which damages the device and reduces quantum efficiency

Engineering Contradiction:

Improvetop surface temperatureVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The package structure is segmented into distinct functional layers: LED array layer, phosphor layer, transparent encapsulant layer, and heat dissipation layer. This segmentation allows each layer to perform its specific function optimally while managing heat effectively through the structured arrangement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A transparent encapsulant layer is introduced as an intermediary between the phosphor layer and the external environment. This layer protects the phosphor particles while allowing light transmission and facilitating heat transfer to the heat dissipation layer below, resolving the contradiction between protection and thermal management.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a highly thermal conductive plate is added to improve heat dissipation, then temperature is reduced, but the device complexity increases

Engineering Contradiction:

Improvedevice reliabilityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat dissipation layer serves multiple functions simultaneously: it acts as a thermal management component to conduct heat away from the LED array, provides structural support for the package, and maintains the mechanical integrity of the assembly. This multi-functionality reduces the need for additional separate components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The package employs composite material structures, including the transparent encapsulant layer that combines optical transparency with thermal conductivity, and the heat dissipation layer that integrates high thermal conductivity materials with structural properties. These composite materials achieve multiple performance goals within a unified structure.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces top surface temperatures, enhancing the thermal management of LED array packages and maintaining quantum efficiency.

Implementation Method 1

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2614528B1An LED array package covered with a highly thermal conductive plate

Publication Date: 2016.12.07 BRIDGELUX INC

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AI summary

A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate.