LED Array Transfer Bonding for Precise Light-Emitting Device Assembly
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Solution Overview
Problem
The challenge in manufacturing light-emitting devices lies in efficiently arranging numerous light-emitting diodes on circuit boards or backlight modules, requiring an effective method to transfer and connect large numbers of LED chips, packages, or Chip Scale Packages (CSPs) to achieve optimal performance and reliability.
Innovation Solution
A method involving substrates with intermediate layers and adhesive units, where protrusions formed by laser are used to push light-emitting elements onto adhesive units on a second substrate, ensuring precise positioning and electrical connectivity without direct contact, allowing for efficient transfer and bonding of multiple light-emitting elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional manual or conventional automated methods are used to arrange light-emitting diodes on circuit boards, then positioning can be achieved, but manufacturing efficiency and productivity are low due to the time-consuming nature of individual placement
Solution Approach 1:
The patent segments the LED arrangement process into two distinct phases: (1) pre-arranging multiple LEDs on a temporary substrate in a controlled environment, and (2) transferring the entire array to the circuit board in a single operation. This segmentation enables parallel processing and eliminates sequential placement bottlenecks, dramatically improving productivity while reducing total arrangement time.
Solution Approach 2:
The patent performs preliminary actions by pre-positioning multiple light-emitting diodes on a temporary substrate with predetermined patterns before the actual mounting process. This preliminary arrangement includes pre-aligning LEDs with their respective mounting positions and pre-establishing electrical connections, which accelerates the final transfer operation and reduces on-site assembly time.
2Manufacturing precision
If conventional transfer methods are used, then LEDs can be moved to the circuit board, but positioning precision deteriorates due to alignment errors and manual handling variations
Solution Approach 1:
The patent introduces a temporary substrate as an intermediary carrier that maintains precise LED positions during the transfer process. This intermediary substrate includes alignment markers and positioning structures that ensure accurate registration with the circuit board, eliminating direct handling of individual LEDs and preserving positioning precision throughout the transfer operation.
Solution Approach 2:
The patent replaces manual mechanical placement operations with automated transfer mechanisms that use suction cups, robotic arms, or pick-and-place machines. These automated systems provide consistent, repeatable positioning with micrometer-level precision, eliminating the variability and errors associated with manual alignment and placement operations.
3Reliability
If individual LED placement is performed to ensure electrical connectivity, then connection reliability can be achieved, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent merges multiple individual placement operations into a single collective transfer operation. By pre-arranging LEDs with their electrical connections already established on the temporary substrate, the system transfers an entire array of connected LEDs in one operation, maintaining connection reliability while dramatically simplifying the manufacturing process and reducing operational complexity.
Solution Approach 2:
The patent performs preliminary electrical connection establishment on the temporary substrate before transfer, including pre-soldering, pre-conducting, or pre-attaching electrical traces. This preliminary action ensures that electrical connectivity is already verified and secured before the final mounting, reducing the need for complex post-assembly testing and rework operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient transfer and connection of light-emitting elements, enhancing the reliability and performance of light-emitting devices by maintaining precise positioning and electrical connectivity, thereby improving the manufacturing efficiency of displays and backlight modules.
Implementation Method 1
forming a first protrusion to push the second light-emitting element toward the first substrate
Implementation Method 2
forming a first adhesive unit on the first substrate, connecting the second light-emitting element to the first adhesive unit
Data Source
AI summary
This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements are partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.