LED Array Dynamic Heating for Semiconductor Wafer Processing
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Solution Overview
Problem
Current techniques for selectively heating workpieces during semiconductor processing lack precision and spatial control, leading to uneven heating and reduced efficiency in temperature-sensitive processes.
Innovation Solution
A system utilizing LED arrays, strategically arranged and controlled to emit light at specific wavelengths absorbed by the workpiece, allowing for dynamic and precise heating of small portions before or concurrent with ion beam exposure, enabling independent actuation of each LED for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional heating techniques are used to heat workpiece portions, then heating can be achieved, but the spatial control and temperature precision are insufficient
Solution Approach 1:
The heating system is segmented into multiple independently controllable LED elements arranged in arrays, allowing selective heating of specific workpiece regions. Each LED or LED group can be controlled individually to create precise temperature profiles across different areas of the workpiece, achieving spatial resolution that conventional heating methods cannot provide.
Solution Approach 2:
The patent applies local quality by enabling different regions of the workpiece to receive different heating conditions through selective LED activation. This allows specific areas to be heated to different temperatures based on process requirements, creating localized temperature gradients that improve processing uniformity while maintaining overall system simplicity.
2Manufacturing precision
If heating is applied uniformly across the workpiece, then simple control is maintained, but temperature-sensitive processes cannot achieve the required processing uniformity
Solution Approach 1:
The heating system transitions from static uniform heating to dynamic selective heating. The LED arrays can be dynamically controlled to adjust which regions are heated and to what temperature, allowing the system to adapt to different process requirements and workpiece positions while maintaining ease of operation through programmable control.
Solution Approach 2:
The system performs preliminary heating of specific workpiece regions before processing to ensure optimal temperature conditions are established in advance. This preliminary action allows temperature-sensitive processes to proceed with improved uniformity by pre-conditioning the workpiece surfaces that will be processed.
3Measurement precision
If the heating system targets only the specific region needing temperature control, then processing precision is improved, but the system complexity increases
Solution Approach 1:
The LED array system is designed to be multi-functional, serving both as a heating source and a spatial control mechanism. The same LED elements that provide heating also enable precise spatial targeting through selective activation, eliminating the need for separate control mechanisms and reducing overall system complexity despite the enhanced capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves a temperature gradient of greater than 10° C/cm and a 15° C rise in temperature within 5 seconds, providing the necessary precision and uniformity for improved semiconductor processing.
Implementation Method 1
The LEDs are selected so that they emit light in a frequency range that is readily absorbed by the workpiece, thus heating the workpiece
Implementation Method 2
A dynamic heating system utilizes an array of light emitting diodes (LEDs) to heat a portion of a workpiece
Data Source
AI summary
A system and method for dynamic heating of a workpiece during processing is disclosed. The system includes an ion source and a plurality of LEDs arranged in an array, which are directed at a portion of the surface of the workpiece. The LEDs are selected so that they emit light in a frequency range that is readily absorbed by the workpiece, thus heating the workpiece. In some embodiments, the LEDs heat a portion of the workpiece just before that portion is processed by an ion beam. In another embodiment, the LEDs heat a portion of the workpiece as it is being processed. The LEDs may be arranged in an array, which may have a width that is at least as wide as the width of the ion beam. The array also has a length, perpendicular to its width, having one or more rows of LEDs.