LED Assembly Heat Radiation Opening for Thermal Management

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Solution Overview

Problem

Liquid crystal display devices using LEDs as a light source face issues with heat radiation, leading to increased temperature, reduced lifetime, and decreased display quality due to the low heat transfer coefficient of traditional flexible printed circuit boards.

Innovation Solution

The implementation of a light emitting diode assembly with a base film having conductive layers and coverlays, including a heat radiation opening, allows for effective heat dissipation by exposing the conductive layers and using a heat radiation opening to transfer heat efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional flexible printed circuit boards are used for LED assembly, then the device structure is simple and manufacturing is easy, but heat radiation efficiency is poor leading to temperature increase

Engineering Contradiction:

ImproveLED temperatureVSAvoidcircuit board structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The circuit board is segmented into multiple functional layers including a base film, first conductive layer, first coverlay, second conductive layer, and second coverlay with heat radiation opening. This segmentation allows each layer to perform specific functions related to heat management while maintaining overall structural integrity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second coverlay acts as an intermediary element that introduces a heat radiation opening, serving as a mediator between the LED light source and the external environment for efficient heat dissipation. The coverlay structure enables heat transfer pathways without requiring complete structural redesign.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If LEDs are used as light source, then power consumption is low and reliability is high, but heat generation causes luminance reduction and lifetime decrease

Engineering Contradiction:

ImproveLED lifetimeVSAvoidLED operating temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The invention converts the harmful heat generated by LEDs into a manageable parameter by creating dedicated heat radiation pathways. The heat radiation opening in the second coverlay transforms the problematic heat accumulation into controlled heat dissipation, maintaining LED reliability while managing thermal effects.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The invention changes the thermal parameters of the circuit board structure by introducing conductive layers and heat radiation openings. This modifies the heat transfer coefficient and thermal conductivity of the assembly, enabling effective heat management while maintaining LED operational parameters within optimal ranges.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If heat radiation opening is added to the circuit board, then heat dissipation efficiency is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcircuit board fabrication

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The heat radiation opening is incorporated into the second coverlay during the preliminary manufacturing stages. By pre-forming the opening in the coverlay material before final assembly, the manufacturing process is simplified compared to post-processing methods, and the heat dissipation structure is already in place for efficient thermal management.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design minimizes temperature increase, prevents luminance reduction, and enhances the lifetime of LEDs by facilitating prompt heat radiation, thereby improving the overall display quality and efficiency.

Implementation Method 1

first and second conductive layers 225a and 225b formed on the first and second surfaces, respectively, of the base film 221

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the second coverlay 229b includes a heat radiation opening 230, so that a heat of high temperature generated from the plurality of LEDs 210 is promptly and effectively radiated

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP3029516B1LED assembly and liquid crystal display device including the same

Publication Date: 2019.08.28 LG DISPLAY CO LTD

Figure 1
Figure 2
Figure 3A~3B

AI summary

Disclosed is a light emitting diode assembly comprising: a base film (221) having first and second surfaces opposite to each other; first and second conductive layers (225a, 225b) on the first and second surfaces, respectively; a first coverlay (229a) on the first conductive layer, the first coverlay including an open portion exposing the first conductive layer; a second coverlay (229b) on the second conductive layer, the second coverlay including a heat radiation opening (230); and a plurality of light emitting diodes (LEDs 210) on the first coverlay, the plurality of LEDs contacting the first conductive layer exposed through the open portion.