LED Assembly Thermal Dissipation via Substrate Vias
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Solution Overview
Problem
Conventional light emitting diode (LED) assemblies suffer from inefficient thermal dissipation and overheating, leading to potential short circuits and thermal damage to adjacent components, with existing heat sinks and cooling agents making the designs bulky and complex.
Innovation Solution
A light emitting diode assembly featuring multiple substrates with LEDs mounted on each, where the substrates are thermally connected through conductive projections to facilitate heat distribution among them, eliminating the need for heat sinks or cooling agents and allowing for compact and efficient thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks and cooling agents are used to improve thermal dissipation, then thermal dissipation performance is improved, but device complexity and volume increase
Solution Approach 1:
The patent merges the substrate structure with thermal dissipation function by creating through-substrate vias that directly connect heat-generating LED regions to heat dissipation paths. This integration eliminates the need for separate heat sinks and cooling agents, achieving thermal management within the existing substrate architecture rather than adding external cooling components.
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional heat management by creating vertical thermal pathways through the substrate using through-substrate vias. This dimensional change allows heat to be conducted from the LED mounting region through the substrate thickness to external heat dissipation structures, enabling efficient thermal management in a compact vertical configuration.
2Temperature
If heat sinks and cooling agents are used to improve thermal dissipation, then thermal dissipation performance is improved, but volume increases
Solution Approach 1:
The substrate is designed to serve dual functions: electrical support for LEDs and thermal conduction path. The through-substrate vias integrate heat dissipation functionality within the substrate itself, eliminating the need for separate bulk heat sinks and reducing overall assembly volume.
Solution Approach 2:
By creating vertical thermal conduction paths through the substrate thickness, the patent enables three-dimensional heat management that dissipates heat efficiently without requiring large horizontal heat sink surfaces, thus reducing overall assembly volume.
3Illumination intensity
If multiple LEDs are mounted on a substrate, then light output is improved, but heat generation increases causing overheating
Solution Approach 1:
The substrate is divided into multiple regions with through-substrate vias distributed throughout, creating multiple independent thermal conduction paths. This segmentation of thermal management allows heat from multiple LEDs to be dissipated through distributed via structures, preventing heat accumulation and overheating while maintaining high light output.
Solution Approach 2:
The through-substrate vias act as thermal intermediaries, providing dedicated heat conduction pathways that transfer heat away from LED mounting regions through the substrate to external dissipation structures, effectively mediating between heat generation at the LED junctions and heat dissipation to the environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal dissipation performance, preventing overheating and allowing for a more compact and flexible LED assembly design with improved heat distribution, reducing the risk of thermal damage and enabling efficient light emission.
Implementation Method 1
The first and second substrates are thermally connected for thermal distribution between the substrates
Data Source
AI summary
A light emitting diode (LED) assembly includes a first substrate carrying a first plurality of LEDs mounted thereon and a second substrate spaced apart from the first substrate. The second substrate carries a second plurality of LEDs thereon. The first and second substrates are thermally connected for thermal distribution between the substrates.