Light Emitting Device Asymmetric Element Arrangement
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Solution Overview
Problem
High-luminance light emitting devices with multiple semiconductor elements face challenges in heat resistance and encapsulant degradation due to concentrated heat and light, leading to potential cracking of the encapsulant when side surfaces of elements face each other.
Innovation Solution
A light emitting device design featuring a resin package with a specific arrangement of first and second light emitting elements, where only a part of their side surfaces face each other, reducing the area of the encapsulant exposed to heat and light, and incorporating a reflective resin portion to dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple light emitting elements are arranged with side surfaces facing each other to increase luminance, then the luminance is improved, but the encapsulant is degraded by concentrated heat and light causing cracking
Solution Approach 1:
The light emitting elements are arranged asymmetrically such that their side surfaces do not directly face each other, but are offset in the vertical direction. This asymmetric arrangement prevents the formation of concentrated heat and light regions between opposing side surfaces, thereby protecting the encapsulant from degradation while maintaining high luminance output.
Solution Approach 2:
The patent introduces a vertical dimension offset between the side surfaces of adjacent light emitting elements. Instead of arranging elements in a simple planar grid where side surfaces face each other, the elements are positioned at different vertical heights, distributing the heat and light exposure across three-dimensional space and preventing concentration at any single point.
2Illumination intensity
If light emitting elements are arranged in a grid pattern to increase luminance, then the luminance is improved, but the heat concentration degrades the encapsulant
Solution Approach 1:
The asymmetric vertical positioning of light emitting elements disrupts the symmetric heat distribution pattern that would occur in a conventional grid arrangement. This prevents heat concentration at specific points between facing side surfaces, thereby reducing peak temperatures while maintaining overall high luminance output from the multiple elements.
Solution Approach 2:
By offsetting light emitting elements in the vertical dimension, the patent creates a three-dimensional heat distribution pattern instead of a two-dimensional planar pattern. This spatial distribution prevents heat accumulation at any single location, effectively reducing heat concentration while preserving the high luminance generated by multiple active elements.
Data Source
AI summary
A light emitting device includes a resin package including: a first lead and a second lead, each including a top surface and a bottom surface, and a first resin portion located between the first lead and the second lead and extending in a first direction; a first light emitting element and a second light emitting element arrayed on the top surface of the first lead in the first direction, the first light emitting element and the second light emitting element each including at least a first side surface; and an encapsulant located on the top surface of the first lead and covering the first light emitting element and the second light emitting element. The first side surface of the first light emitting element and the first side surface of the second light emitting element partially face each other.