LED Backlight Unit Copper Heat Dissipation Plates

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Solution Overview

Problem

Conventional backlight units using LEDs face challenges in effectively dissipating heat generated by LED chips, leading to increased temperature, reduced light emission, wavelength variation, and shortened LED lifespan due to the use of inexpensive insulating substrates with poor thermal conductivity.

Innovation Solution

The proposed backlight unit employs copper upper and lower heat dissipation plates with a thin insulating film and strategically designed through holes to reduce thermal resistance, utilizing copper for excellent thermal conductivity and minimizing weight and cost, while maintaining effective heat dissipation through conduction and convection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If metal core substrates are used for LED mounting, then heat dissipation performance is improved, but manufacturing cost increases significantly

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The substrate is divided into two functional layers: an insulating substrate for electrical isolation and circuit patterns, and a separate metal heat dissipation plate for thermal management. This segmentation allows each layer to perform its specialized function optimally while using cost-effective materials.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The insulating substrate and metal heat dissipation plate are combined into a hybrid substrate structure that integrates electrical insulation and thermal conduction functions. The metal plate is coupled to the insulating substrate to form a unified heat dissipation system that maintains electrical isolation while achieving effective heat removal.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If insulating substrates are used to reduce cost, then manufacturing cost decreases, but heat dissipation performance deteriorates

Engineering Contradiction:

Improvemanufacturing costVSAvoidheat dissipation performance

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

A metal heat dissipation plate serves as an intermediary component between the LED packages and the insulating substrate. This plate conducts heat away from the LED chips while the insulating substrate provides electrical isolation, allowing cost-effective materials to be used without sacrificing thermal performance.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The substrate system uses composite construction combining insulating material (for electrical isolation) and metal material (for thermal conduction). This composite approach allows the system to simultaneously achieve electrical insulation, effective heat dissipation, and cost efficiency by selecting appropriate materials for each functional requirement.

Inventive Principle:

Principle #40Composite materials

3Illumination intensity

If LED chips operate at high temperature, then light emission decreases and wavelength varies, but lifespan is shortened

Engineering Contradiction:

Improvelight emissionVSAvoidLED lifespan

Core Design Contradiction:

Illumination intensityVSDuration of action of stationary object

Solution Approach 1:

The system converts the harmful heat generated by LED operation into a manageable thermal flow by directing it through the metal heat dissipation plate to the heat sink. This transforms the harmful thermal energy into a controlled heat transfer process that protects the LED chips from overheating, maintaining both light emission quality and extended lifespan.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly reduces thermal resistance by 65% compared to conventional units, enhancing LED chip cooling, increasing luminance and lifespan, and lowering production costs by using an inexpensive insulating substrate.

Implementation Method 1

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

maintaining effective heat dissipation through conduction and convection

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentEP2170024B1Backlight unit equipped with light emitting diodes

Publication Date: 2017.08.09 SAMSUNG ELECTRONICS CO LTD

Figure 1~2
Figure 3~4

AI summary

Disclosed herein is a backlight unit (100) equipped with LEDs. The backlight includes an insulating substrate (110), a plurality of LED packages (130), an upper heat dissipation plate (114), and a lower heat dissipation plate (116). The insulating substrate is provided with predetermined circuit patterns (111,112). The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. A chassis (150) is disposed in the remaining surface of the insulating substrate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole (115), and the through hole and the upper heat dissipation plate have a predetermined area ratio.