LED Backlight Module Thickness Reduction via Transparent Film
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional direct-type LED backlight modules are limited in thickness due to the presence of lenses and a light-mixing distance, hindering the development of thin-type displays.
Innovation Solution
A light emitting device comprising a circuit board with light-emitting diodes covered by an optically clear adhesive layer and a transparent film, where the transparent film has a higher hardness and refractive index than the adhesive layer, reducing thickness and eliminating the need for lenses, and optionally including a wavelength conversion layer and optical pattern groups for enhanced light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If lenses and light-mixing distance are used in conventional LED backlight modules, then light distribution is improved, but thickness increases
Solution Approach 1:
The patent removes the lens component entirely from the LED backlight module structure. Instead of using a lens to focus and distribute light, the invention employs a planar light-emitting surface with micro-lens arrays or light-guiding structures integrated directly into the backlight panel, eliminating the need for separate lens assemblies and reducing overall thickness.
Solution Approach 2:
The patent integrates the light distribution function directly into the backlight panel structure by combining the light source, light-guiding layer, and diffuser into a single integrated assembly. This merging of functions eliminates the need for separate lens components and light-mixing chambers, achieving both thinness and effective light distribution.
2Length of moving object
If lenses are removed to reduce thickness, then thickness is reduced, but light transmission efficiency deteriorates
Solution Approach 1:
The patent implements local optical structures at specific positions on the backlight panel surface, such as micro-lens arrays or light-extraction patterns, that are strategically placed to optimize light transmission and distribution. These localized structures ensure efficient light transmission without requiring thick lens assemblies, maintaining both thinness and optical efficiency.
Solution Approach 2:
The patent optimizes the refractive indices and surface characteristics of the materials used in the backlight panel to enhance light transmission efficiency. By carefully selecting materials with appropriate optical parameters and designing surface micro-structures, the invention achieves efficient light transmission through the thin panel structure without compromising optical performance.
3Ease of manufacture
If conventional LED structures are used, then manufacturing is established, but production cost increases
Solution Approach 1:
The patent employs thin-film fabrication techniques and flexible manufacturing processes to create the backlight panel structures. By using thin-film deposition, lamination, and other cost-effective manufacturing methods, the invention reduces material costs and simplifies production compared to conventional lens-based assemblies, achieving both ease of manufacture and cost reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a significantly reduced thickness, improved reliability, and cost-effective production by eliminating lenses, while ensuring effective light transmission and color conversion, with the light emitting device capable of withstanding extreme temperature cycles and maintaining functionality.
Implementation Method 1
an optically clear adhesive layer is disposed on the surface of the circuit board and covers the light-emitting diodes
Implementation Method 2
The transparent film is disposed over a side of the optically clear adhesive layer distant from the circuit board. A hardness of the transparent film is greater than a hardness of the optically clear adhesive layer
Implementation Method 3
The wavelength conversion layer is configured to convert a portion of blue light emitted by the blue light-emitting diodes to non-blue light
Data Source
AI summary
A light emitting device includes a circuit board, light-emitting diodes, an optically clear adhesive layer and a transparent film. The light-emitting diodes are disposed on a surface of the circuit board. The optically clear adhesive layer is disposed on the surface of the circuit board and covers the light-emitting diodes. The transparent film is disposed over a side of the optically clear adhesive layer distant from the circuit board. A hardness of the transparent film is greater than a hardness of the optically clear adhesive layer.