LED Backlight Unit Fixing Mechanism for Heat Radiation
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Solution Overview
Problem
Conventional LED backlight units face issues with reduced brightness due to inadequate heat radiation caused by thermosetting adhesives, which also complicate the assembly process and reduce productivity.
Innovation Solution
The LED backlight unit eliminates the use of thermosetting adhesive by employing a fixing mechanism with protrusions and holes that allow surface contact between the substrate and chassis, enabling effective heat radiation and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting adhesive is used to fix the light source to the chassis, then the light source is securely fixed, but heat radiation is blocked and brightness decreases
Solution Approach 1:
The patent removes the thermosetting adhesive from the system entirely, extracting the harmful element that blocked heat radiation. The light source is fixed to the chassis using mechanical means (protrusions fitting into recesses) instead of adhesive, eliminating the thermal barrier while maintaining secure fixation.
Solution Approach 2:
The patent introduces a chassis as an intermediary thermal conduction path between the light source and the external environment. The chassis serves as a heat sink that conducts away heat from the LED substrate, preventing brightness degradation while still allowing secure mechanical mounting.
2Stability of the object's composition
If thermosetting adhesive is used to assemble the light guide plate, then components are fixed in position, but the assembly process becomes complex and productivity decreases
Solution Approach 1:
The patent replaces the chemical bonding system (thermosetting adhesive) with a mechanical fastening system (protrusions and recesses). This substitution eliminates the need for adhesive application, curing time, and complex assembly procedures, thereby显著提高 productivity while maintaining stable component positioning.
Solution Approach 2:
The fixing structure is segmented into discrete protrusions on the light guide plate that fit into corresponding recesses in the chassis. This segmentation allows for simple, snap-fit assembly without requiring continuous adhesive application, simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures superior heat radiation, maintains high brightness, and enhances productivity by eliminating adhesive-related issues and simplifying the assembly process.
Implementation Method 1
The light emitting diode (LED) used in the conventional backlight unit 100 generates light by virtue of luminescence (electroluminescence) arising when voltage is applied to a semiconductor.
Implementation Method 2
the substrate 122 having a plurality of LEDs 124 disposed thereon is fastened onto a lower chassis 110 via a thermosetting adhesive 112
Data Source
AI summary
An LED backlight unit has a substrate, a plurality of light emitting diodes disposed on the substrate, and a light guide plate is placed adjacent to the light source. A chassis fixes the light source and the light guide plate therein. Fixing means engagingly fit a side of the light guide plate into the light source plate and chassis with the substrate of the light source is fixed in surface contact with the chassis. The light guide plate is assemblable without a thermosetting adhesive.