LED Backlight Circuit Board Heat Conduction for LCD Displays
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Solution Overview
Problem
Conventional liquid crystal displays using LEDs as light sources face challenges with heat dissipation, which affects the longevity and brightness of the LEDs, as existing heat management solutions are inadequate.
Innovation Solution
The implementation of a heat conductive circuit board with thermal conductive materials and a heat sink on the second planar side, where conductive traces on the circuit board facilitate heat transfer from the LEDs to the frame, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LEDs are used as light sources in liquid crystal displays, then durability, size and weight are improved, but heat dissipation becomes problematic affecting LED life and brightness
Solution Approach 1:
A thermal conductive member is introduced as an intermediary component between the LED and the circuit board to facilitate heat transfer. This mediator transfers heat from the LED mounting area through the circuit board to the heat sink, resolving the heat accumulation problem while maintaining LED durability
Solution Approach 2:
The heat dissipation function is extracted and separated from the LED assembly by introducing a dedicated heat sink component. The thermal conductive member extracts heat from the LED area and delivers it to the heat sink, which dissipates heat independently, thereby protecting the LED from thermal damage
2Temperature
If heat conductive material is added to improve heat dissipation, then heat transfer efficiency is improved, but device structure becomes more complex
Solution Approach 1:
The thermal conductive member is merged with the circuit board structure, utilizing the circuit board as both the electrical substrate and the heat conduction path. The thermal conductive member extends through holes in the circuit board, combining structural support, electrical connection, and heat dissipation functions into a unified design
Solution Approach 2:
The circuit board is designed to serve multiple functions: it provides electrical connections for LEDs, structural support for the display device, and a heat conduction path for thermal management. The thermal conductive member integrates with these existing functions rather than adding separate independent components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves heat dissipation efficiency, extending the lifespan and maintaining brightness of LEDs by effectively transferring heat away from the LED mounting area to a heat sink, thereby addressing the heat-related issues in LED-based liquid crystal displays.
Implementation Method 1
heat conductive material penetrates through the circuit board to facilitate heat conduction from a first planar side on which the LEDs are mounted, to a second planar side of the circuit board
Implementation Method 2
A heat sink may be provided on the second planar side, which may be a frame of the display device
Implementation Method 3
A heat conductive layer may be provided between the second planar side and the heat sink, which heat conductive layer may also function as an insulating layer between the second planar side and the frame
Data Source
AI summary
Systems for displaying images are provided. An embodiment of a system comprises a liquid crystal display module, and the liquid crystal display module comprises a backlight assembly. The backlight module primarily includes a circuit board and at least an LED disposed on a first planar side of the circuit board. The circuit board comprises at least a hole and a heat conductor extending through the hole. Heat from the LED on the first planar side is dissipated to a second planar side of the circuit board by the heat conductor through the hole.