LED Backlight Unit Heat Radiation Path Simplification
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED backlight units have inefficient heat radiation paths due to multiple material interfaces, leading to reduced heat dissipation efficiency and increased manufacturing costs, with a large number of components and expensive heat-conductive boards contributing to these issues.
Innovation Solution
The LED backlight unit features a simplified heat radiation path with a heat conducting member exposed on the underside of the molding, mounted directly on the metal chassis, and a reflector integrated onto the board to reduce component count and manufacturing costs, using a non-heat-conductive board with a circuit pattern and mounting holes for the light source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional MCPCB with multiple material interfaces is used for heat radiation, then heat conduction path is established, but heat radiation efficiency deteriorates due to multiple interfaces
Solution Approach 1:
The patent extracts and removes the MCPCB from the heat radiation path, replacing it with a simple metal chassis that provides direct thermal contact with the LED heat conducting member. This eliminates multiple material interfaces (solder joint, adhesive layer, board material) and creates a direct metal-to-metal heat conduction path, thereby improving heat radiation efficiency while reducing structural complexity.
2Loss of energy
If MCPCB is used as heat-conductive board, then heat conduction function is provided, but manufacturing cost increases
Solution Approach 1:
The patent replaces the expensive MCPCB with a standard PCB that has poor heat conduction properties, compensating for this by using the metal chassis as the primary heat dissipation path. The metal chassis is a standard structural component that is already present in the display device, eliminating the need for costly specialized heat-conductive boards while maintaining effective heat dissipation.
Solution Approach 2:
The metal chassis serves dual functions: it provides structural support for the display device and acts as the primary heat dissipation path. By making the chassis multi-functional, the patent eliminates the need for separate expensive heat-conductive boards like MCPCB, thereby reducing manufacturing costs while maintaining heat dissipation efficiency.
3Illumination intensity
If reflector is arranged separately from board, then light reflection function is provided, but component count increases
Solution Approach 1:
The patent merges the reflector with the PCB by printing a reflective layer directly onto the board surface. This integration eliminates the reflector as a separate component, reducing part count and assembly steps while maintaining the light reflection function necessary for directing LED light toward the display panel.
Solution Approach 2:
The PCB serves multiple functions simultaneously: it provides electrical connections for LEDs, structural support, and light reflection. By making the board self-sufficient and multi-functional, the patent eliminates the need for separate reflector components, thereby simplifying the overall structure and reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat radiation efficiency, reduces component count, and lowers manufacturing costs by simplifying the assembly process and replacing expensive heat-conductive boards with less costly alternatives, thereby improving product reliability and reducing fabrication expenses.
Implementation Method 1
a heat conducting member 11b mounted on the MCPCB 12 to serve as heat radiating means
Implementation Method 2
a reflector arranged on a top surface of the board to reflect light generated from the light source
Implementation Method 3
The LED is typically a semiconductor device which produces minority carriers (e.g., electrons or holes) by using a pn junction structure of a semiconductor and then re-combines the carriers to generate light
Data Source
AI summary
An LED backlight unit includes a light source; a board including a circuit pattern printed on an underside thereof, and having at least one mounting hole perforated therein where the light source is inserted; a metal chassis having an inside surface on which an underside of the light source is mounted, and receiving the board to be arranged in parallel to and with a gap from the metal chassis; and a reflector arranged on a top surface of the board to reflect light generated from the light source. The heat radiating path for transferring heat from the light source to the outside can be more simplified to enhance heat radiation efficiency thereby raising product reliability. The number of whole components can be reduced and the board with the light mounted thereon can be replaced with an inexpensive part thereby saving fabrication cost.