LED Backlight Heat Sink Design for Thermal Management
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Solution Overview
Problem
The existing backlight modules in LCD devices suffer from inefficient heat dissipation due to long heat conduction paths, leading to component damage, reduced stability, and decreased service life, as heat is accumulated within the module, affecting the safety and optical quality of the display.
Innovation Solution
A backlight module design featuring LED chips and circuits directly arranged on a heat sink, preferably made of metal with an insulating layer, and radiating fins, which reduces heat accumulation by enhancing heat dissipation efficiency through direct contact with air, replacing traditional PCBs and aluminum extrusions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is conducted through a long path via backplane and air convection, then heat dissipation is achieved, but heat accumulates in the inner cavity leading to component damage and reduced service life
Solution Approach 1:
The patent extracts the heat dissipation function from the backplane structure and assigns it to a dedicated heat sink component. The heat sink is specifically designed to contact the LED chip and conduct heat away from the inner cavity, separating the heat dissipation path from the optical path and preventing heat accumulation that would otherwise damage components.
Solution Approach 2:
The heat sink acts as an intermediary between the LED chip and the external environment. It provides a dedicated thermal conduction path that mediates heat transfer, preventing direct heat accumulation in the inner cavity while maintaining the optical performance of the backlight module.
2Ease of manufacture
If PCB is used as heat conduction path, then circuit integration is achieved, but heat accumulation occurs due to poor heat conduction properties
Solution Approach 1:
The patent merges the circuit board function with the heat sink function by integrating circuit traces directly onto the heat sink surface. This combination allows the heat sink to serve dual purposes: conducting heat away from the LED chip and providing electrical connectivity, thereby eliminating the need for separate PCB and improving both heat dissipation and manufacturing efficiency.
Solution Approach 2:
The heat sink is constructed using composite material structures that combine excellent thermal conduction properties with electrical conductivity. The material composition is specifically designed to facilitate both heat dissipation and circuit integration, overcoming the limitations of traditional PCB materials.
3Temperature
If LED chip is directly mounted on heat sink, then heat dissipation path is shortened, but manufacturing precision requirements increase
Solution Approach 1:
The heat sink is pre-formed with integrated mounting structures and circuit traces before the LED chip is installed. This preliminary preparation ensures precise positioning and electrical connectivity, reducing the precision requirements during the actual mounting process while maintaining short heat dissipation paths.
Solution Approach 2:
The heat sink is designed with self-aligning features and integrated mounting mechanisms that automatically position the LED chip correctly during assembly. This self-service capability reduces the need for high-precision manual alignment, making the direct mounting process more tolerant of manufacturing variations while maintaining optimal heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat, reducing internal temperatures and extending the service life of components, while improving the optical quality and display effect of the LCD device by minimizing hotspot formation and dark zones.
Implementation Method 1
heat emitted by the lightbar 140 is conducted to the surface of the backplane 100 through the side wall of the backplane 100
Implementation Method 2
heat is dissipated through air convection
Implementation Method 3
radiating fins, which reduces heat accumulation by enhancing heat dissipation efficiency through direct contact with air
Data Source
AI summary
The invention provides a backlight module, an LCD device and a light source of the backlight module. The backlight module includes an LED chip, and a heat sink; the LED chip and a circuit thereof are directly arranged on the heat sink. In the invention, because the LED chip of the backlight module and the circuit thereof are directly arranged on the heat sink, heat emitted by the LED chip can be conducted out through the heat sink with good heat dissipation effect; thus, the inside temperature of the backlight module is reduced, and the heat dissipation efficiency of the backlight module is increased.