LED Backlight Housing with Deep Cavity for Thermal Management
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Solution Overview
Problem
Liquid crystal display devices using LEDs as light sources face issues with increased operation temperature affecting luminous efficiency and limited mounting options due to rigid metal plates, and increased wire complexity with higher light intensity requirements.
Innovation Solution
A liquid crystal display device design featuring a housing case with a larger distance between its upper and lower surfaces to accommodate a circuit board with a light guide plate and cushion member, allowing for efficient heat radiation and flexible mounting of LEDs, while separating electrical components from the light-emitting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a number of LEDs are used to increase light intensity, then the luminous efficiency decreases due to rising operation temperature
Solution Approach 1:
The backlight unit is divided into multiple independent LED modules, each with its own heat dissipation path. The circuit board is segmented into multiple regions with separate heat radiation structures, allowing heat from different LED groups to be dissipated independently, preventing localized overheating that would reduce luminous efficiency.
Solution Approach 2:
A heat radiation plate made of heat-conductive resin is introduced as an intermediary between the LEDs and the housing case. This plate serves as a thermal mediator that efficiently conducts heat away from the LEDs while electrically isolating them, maintaining optimal operating temperature for high luminous efficiency even with multiple LEDs.
2Temperature
If a metal plate is used as the circuit board for heat radiation, then the mounting form is limited due to rigidity
Solution Approach 1:
The circuit board material transitions from rigid metal to flexible heat-conductive resin, changing the physical parameter of flexibility while maintaining the heat radiation function. This allows the circuit board to be bent and adapted to various mounting configurations without compromising thermal management capabilities.
Solution Approach 2:
The circuit board uses a composite structure combining resin material with embedded heat radiation structures. This composite approach provides both the flexibility needed for various mounting forms and the thermal conductivity required for effective heat radiation, overcoming the limitations of pure metal plates.
3Illumination intensity
If the number of light emitting elements increases to achieve higher intensity, then the area of the circuit board increases
Solution Approach 1:
The circuit board is nested within the housing case in a space-efficient configuration. The housing case is designed with a larger distance between upper and lower surfaces specifically in the vicinity of the circuit board, allowing the board to be positioned vertically or at an angle, effectively utilizing three-dimensional space rather than expanding horizontal area.
Solution Approach 2:
The circuit board is oriented in a different spatial dimension, positioned vertically or at an angle within the housing case rather than horizontally. This dimensional change allows more LEDs to be mounted on the board without increasing the horizontal footprint, as the board utilizes the vertical space created by the larger housing case distance.
4Device complexity
If the area of the circuit board increases to accommodate more wires, then the housing space requirement increases
Solution Approach 1:
The circuit board and housing case are merged into an integrated structure where the housing case directly supports and houses the circuit board. The heat radiation plate is also integrated with the housing case, combining multiple functions (structural support, heat radiation, and space definition) into a single unified component, reducing the need for separate housing elements.
Solution Approach 2:
The circuit board is nested within the housing case in a compact arrangement. The housing case is designed to accommodate the increased circuit board area without proportionally increasing overall volume, as the board is positioned to utilize the internal space efficiently, with the larger distance between upper and lower surfaces providing the necessary accommodation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and efficient housing of the LED light source, maintaining high luminous efficiency and accommodating increased circuit board area, thereby improving the overall performance of the liquid crystal display device.
Implementation Method 1
a cushion member disposed between the housing case and the light guide plate
Implementation Method 2
a backlight for irradiating the liquid crystal panel with light, a plurality of light emitting elements provided to the backlight
Data Source
AI summary
There is provided a light source, which can efficiently be housed even if the area of the substrate increases while giving extra consideration to the heat radiation of the light emitting diodes in a liquid crystal display device using the light emitting diodes as a light source. A plate-like light source section is formed by arranging the light emitting diodes on a metal substrate. The plate-like light source section is formed to have a larger area than an entrance surface of a light guide plate, and is disposed so as to face the entrance surface of the light guide plate. The light guide plate and the plate-like light source section are housed in a housing case, and the housing case is formed to have a larger depth in a part for housing the plate-like light source section than in a part for housing the light guide plate. A cushion member is provided between the light guide plate and the housing case to prevent the light guide plate from being moved by vibrations.