LED Backlight Metal Traces for Mini-LED Yield
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Solution Overview
Problem
Mini LED direct-lit backlight devices face challenges in manufacturing process deviations, leading to poor luminous efficiency and light energy loss due to large gaps between reflective materials and pads, which cannot be fully addressed by improving etching precision.
Innovation Solution
The design of metal traces on the backlight substrate, with specific arrangements of positive and negative electrode lines and pad openings, ensures optimal placement of solder paste and reflective materials, reducing process deviations and improving light reflection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the number of mini LEDs is increased to achieve full screen display, then the display coverage is improved, but the manufacturing process deviation and gaps between reflective material and pads increase
Solution Approach 1:
The patent applies preliminary action by pre-designing the metal trace width and pad opening position to compensate for expected process deviations. The metal trace width is specifically designed to be wider than the minimum required, and pad openings are positioned with built-in tolerance margins, so that even when manufacturing deviations occur, the reflective material can still properly contact the pads without creating large gaps.
Solution Approach 2:
The patent changes the geometric parameters of the metal traces and pad openings to optimize for manufacturing tolerance. Specifically, the metal trace width is increased beyond the minimum, and the pad opening dimensions and positions are adjusted to create a more robust assembly that can accommodate process variations while maintaining good electrical and optical contact.
2Manufacturing precision
If etching precision is improved to reduce process deviation, then the manufacturing precision is improved, but the cost and complexity increase
Solution Approach 1:
Instead of relying on high-precision etching during manufacturing, the patent takes preliminary action in the design phase by specifying larger metal trace widths and optimized pad opening positions. This preliminary design compensation reduces the need for complex, high-precision manufacturing processes while still achieving good manufacturing results.
Solution Approach 2:
The patent changes the design parameters of metal traces and pad openings to be more tolerant of manufacturing variations. By using wider traces and strategically positioned openings, the system can achieve acceptable manufacturing precision without requiring complex or expensive high-precision etching processes.
3Loss of energy
If the gap between reflective material and pads is reduced, then the light reflection efficiency is improved, but the manufacturing difficulty increases
Solution Approach 1:
The patent applies preliminary action by pre-compensating for manufacturing deviations in the design of metal traces and pad openings. The dimensions and positions are set to ensure that even with normal manufacturing variations, the reflective material will contact the pads within an acceptable gap range, maintaining good light reflection efficiency without requiring overly complex manufacturing controls.
Solution Approach 2:
The patent optimizes the geometric parameters of metal traces and pad openings to balance manufacturing ease with optical performance. By using specific width and position values that provide tolerance built-in, the system achieves both easy manufacturing and good light reflection efficiency, avoiding the need for extremely tight gap control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances manufacturing yield, reduces light energy loss, and improves light efficiency by maximizing the coverage of reflective materials and minimizing light transmission through the substrate.
Implementation Method 1
a reflective material layer covering a surface of the backlight substrate
Data Source
AI summary
The present invention discloses a light emitting diode (LED) backlight device and LED display device, including a plurality of backlight partitions; a reflective material layer covering a surface of the backlight substrate; a plurality of metal traces disposed within the backlight partitions and disposed between the backlight substrate and the reflective material layer; a plurality of pad openings penetrating from a surface of the reflective material layer to a surface of the metal traces. An orthographic projection of the pad openings projected toward the backlight substrate is completely within an area of the metal traces; and a plurality of solder paste application regions located in the pad openings. The LED display device assembled by the LED backlight device according to the present invention improves the yield of solder paste printing and die bonding, improves the light reflection, reduces the loss of light energy, and improves the light efficiency.