LED Backlight Quantum Dot Spacing Heat Dissipation
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Solution Overview
Problem
The efficiency of quantum dot materials in light source modules is adversely affected by heat, leading to deterioration and reduced optical performance, and existing solutions struggle to achieve high color reproducibility in white light emission.
Innovation Solution
A light source module design that includes a circuit board with an LED package and a quantum dot package spaced apart to prevent heat-induced damage, using a heat-dissipating encapsulating unit and a light leakage preventing member, allowing for adjustable distance and orientation to enhance wavelength conversion and light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the quantum dot package is placed close to the LED package for compact design, then the device size is reduced, but the quantum dot material deteriorates due to heat from the LED
Solution Approach 1:
The patent introduces a heat dissipation member as an intermediary component positioned between the LED package and the quantum dot package. This mediator absorbs and conducts heat away from the quantum dot material, preventing thermal deterioration while allowing the packages to be placed in close proximity for compact device design.
Solution Approach 2:
The patent extracts the heat management function from the overall package structure by introducing a dedicated heat dissipation member. This separate component specifically addresses the thermal issue without requiring increased spacing between the LED and quantum dot packages, thus maintaining compact form factor while preventing heat-induced deterioration.
2Reliability
If the quantum dot package is spaced apart from the LED package to reduce heat exposure, then the optical efficiency is improved, but the device volume increases
Solution Approach 1:
The heat dissipation member acts as a mediator that enables close spacing between the LED package and quantum dot package while maintaining optimal thermal conditions. This intermediary component allows the system to achieve both high optical efficiency through reduced heat exposure and compact device volume through minimized spacing.
3Productivity
If the quantum dot package is positioned at an optimized distance from the LED package, then the wavelength conversion efficiency is improved, but the manufacturing complexity increases due to precise positioning requirements
Solution Approach 1:
The patent merges the heat dissipation function with the structural support function by integrating the heat dissipation member into the package mounting structure. This combination provides both thermal management and precise positioning in a single component, improving wavelength conversion efficiency while reducing manufacturing complexity compared to separate positioning and cooling mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents quantum dot material deterioration due to heat, maintains appropriate wavelength conversion efficiency, and facilitates the production of white light with high color reproducibility, while allowing for easy adjustment and manufacturing flexibility.
Implementation Method 1
quantum dot materials emit light while excited electrons transition from a conduction band to a valence band. Even quantum dots that are formed of the same material may have different wavelengths according to their particle sizes.
Implementation Method 2
A light source module design that includes a circuit board with an LED package and a quantum dot package spaced apart to prevent heat-induced damage, using a heat-dissipating encapsulating unit
Data Source
AI summary
A light source module includes a circuit board, a light-emitting diode package configured to be mounted on the circuit board, and a quantum dot package which is disposed apart from a side of the light-emitting diode package by a predetermined distance, and mounted on the circuit board and to convert a wavelength of light incident thereupon.