LED Backlight Thermal Management via Insulating Carrier Plate
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Solution Overview
Problem
Existing light-emitting diode systems face challenges in efficiently dissipating heat from light-emitting diode components, particularly in high-power applications like backlighting modules for LCD screens, where conventional thermal management methods may not adequately address heat loss.
Innovation Solution
A light-emitting diode system is designed with a carrier plate having a hole for receiving the diode component, an electrically insulating thermal connection layer applied at the rear side thermally connected to a heat sink, and laterally projecting electrical connection strips for efficient heat dissipation and electrical connectivity, using materials like Sil-Pad for thermal insulation and conductive adhesives or soldering for connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional printed circuit board mounting with thermal through-connections is used, then heat dissipation is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent introduces a carrier plate as an intermediary component between the printed circuit board and the heat sink. This carrier plate simplifies the overall structure by providing a dedicated mounting surface for the LED component, eliminating the need for complex thermal through-connections in the PCB while maintaining effective heat dissipation through the integrated heat sink attachment.
2Reliability
If electrical insulation is provided between heat sink and carrier plate, then electrical safety is improved, but thermal conduction is worsened
Solution Approach 1:
The patent employs a composite material structure for the thermal connection layer that combines electrical insulation properties with thermal conduction capabilities. This layer is positioned between the heat sink and the carrier plate, providing the necessary electrical isolation while maintaining adequate thermal transfer through its thermally conductive composition.
3Stability of the object's composition
If light-emitting diode component is completely embedded in carrier plate, then mechanical stability is improved, but heat dissipation and electrical connection accessibility are worsened
Solution Approach 1:
The patent implements local quality by allowing the LED component to project partially or completely through the carrier plate. This creates different structural zones: the embedded portion provides mechanical stability and structural integration, while the projecting portion enables accessible heat dissipation surfaces and electrical connection points, optimizing both stability and thermal/electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies heat dissipation and electrical connectivity, effectively managing heat loss in high-power applications by using a thermally conductive insulation film and conductive connections, enhancing the performance and reliability of light-emitting diode systems.
Implementation Method 1
an electrically insulating thermal connection layer at the rear side of said carrier plate, said thermal connection layer being thermally conductively connected to said heat sink
Implementation Method 2
a light-emitting diode chip is arranged in a light-emitting diode housing on a heat sink which can be thermally connected at the rear side of the light-emitting diode housing
Data Source
AI summary
A light-emitting diode system (1) comprising at least one light-emitting diode component (2), in which a light-emitting diode chip is arranged in a light-emitting diode housing (21) on a heat sink (22) which can be thermally connected at the rear side (25) of the light-emitting diode housing (21). A carrier plate (3) having a front side (34) and a rear side (31) and a hole for receiving the light-emitting diode component (2) is provided. The light-emitting diode component (2) projects into the hole from the rear side (31) of the carrier plate (3). An electrically insulating thermal connection layer (5) is applied at the rear side (31) of the carrier plate (3), said thermal connection layer being thermally conductively connected to the heat sink (22). A method for producing a light-emitting diode system is also described.