LED Backlight Module Thermal Management via Segmented PCB and Heat-Sinking Frame
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Solution Overview
Problem
Conventional LCD backlight systems using LEDs face issues with heat dissipation, leading to reduced light-emitting efficiency and performance due to the proximity of driving circuit elements on the same PCB, which can cause overheating.
Innovation Solution
A light sourcing module with a substrate having patterned conductor planes and a receiving frame with a heat-sinking groove to efficiently dissipate heat from driving circuit elements, eliminating the need for separate cooling components and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If driving circuit elements are mounted on the same PCB as LEDs, then device complexity is reduced, but heat dissipation becomes insufficient leading to overheating
Solution Approach 1:
The patent divides the PCB into functionally independent regions: a first PCB region for mounting LEDs and a second PCB region for mounting driving circuit elements. This spatial segmentation allows each region to be optimized independently for its specific function, enabling effective heat dissipation for LEDs while providing adequate space for circuit elements without thermal interference.
Solution Approach 2:
The patent extracts the driving circuit elements from the LED mounting area and places them on a separate region of the PCB. This extraction removes the heat-generating circuit elements from proximity to the LEDs, eliminating the thermal interference problem while maintaining electrical connectivity through appropriate circuit design.
2Ease of manufacture
If LEDs are mounted on a PCB with wiring patterns, then ease of manufacture is improved, but heat resistance deteriorates due to poor heat dissipation
Solution Approach 1:
The patent applies different structural characteristics to different regions of the PCB. The first PCB region has a structure optimized for LED mounting and heat dissipation, while the second PCB region has a structure optimized for circuit element mounting. This local differentiation allows each region to perform its function effectively without compromising the other.
Solution Approach 2:
The patent utilizes the dimensional space of the PCB by creating distinct regions in the planar dimension. By organizing LEDs and circuit elements in separate spatial zones on the same PCB substrate, the design achieves both manufacturing simplicity and thermal management without requiring multiple separate boards or complex three-dimensional stacking.
3Productivity
If multiple LEDs are mounted on a single PCB, then productivity is improved, but heat generation increases causing performance degradation
Solution Approach 1:
The patent creates an asymmetric thermal management architecture where the first PCB region dedicated to LEDs provides optimized heat dissipation pathways, while the second PCB region for circuit elements is positioned to minimize thermal coupling. This asymmetric design allows high-density LED assembly without the circuit elements contributing to thermal interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat-sinking and radiating efficiency, maintaining LED performance and reducing production costs by integrating power supply units directly on the substrate and avoiding additional cooling components.
Implementation Method 1
make good thermal contact with the first driving circuit element and to thereby draw heat energy away from the first driving circuit element
Data Source
AI summary
The light sourcing module of a backlit LCD display apparatus includes a light sources and power sources supporting substrate. The supporting substrate supports plural light sources on a top major surface thereof and at least one heat generating and power supplying circuit element that protrudes from a bottom major surface of the supporting substrate. The supporting substrate integrally includes wiring that couples driving power output by power supplying circuit element to the plural light sources. A rear receiving frame includes an integral heat-sinking and dissipating recess or groove that is positioned and dimensioned to receive the power supplying circuit element when the supporting substrate is received by the rear receiving frame. The integral heat-sinking and dissipating recess or groove removes heat from the heat generating and power supplying circuit element so that such heat does not adversely affect performance of the light sources.