LED Backplane Buffer Layer for Scratch-Free Reflective Printing
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Solution Overview
Problem
Traditional light emitting diode (LED) substrates are prone to scratching during the screen printing process for forming a white oil reflective layer, which can lead to short circuits and defects, while spray printing lacks precision and often results in material overflow onto bonding pads, causing oxidation and discoloration.
Innovation Solution
A backplane structure featuring a buffer layer with a base layer and hole structure or flexible particles, which absorbs the force of the squeegee during screen printing and includes a channel with a retaining wall to prevent material overflow during spray printing, ensuring substrate protection and precise layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If screen printing process is used to form white oil reflective layer, then manufacturing precision is improved, but substrate is easily scratched causing short circuit
Solution Approach 1:
A buffer layer is introduced as an intermediary between the substrate and the reflective layer. This buffer layer absorbs the mechanical stress and scratching forces during screen printing, protecting the substrate while still allowing precise printing of the reflective layer on top of it.
Solution Approach 2:
The buffer layer is prepared in advance on the substrate before the screen printing process. It provides pre-cushioning protection against the squeegee pressure and mechanical contact during printing, preventing substrate damage before it occurs.
2Object-affected harmful factors
If spray printing process is used to form white oil reflective layer, then substrate scratching is avoided, but printing accuracy deteriorates and material overflows onto bonding pad
Solution Approach 1:
The buffer layer serves as a mediator that enables the use of screen printing (which requires higher precision) without directly contacting the substrate. This intermediary layer allows for better printing accuracy compared to spray printing while still protecting the substrate.
Solution Approach 2:
The buffer layer is applied selectively in specific regions where the reflective layer needs to be formed, providing localized protection and precision control. This allows for accurate material deposition only where needed, preventing overflow onto bonding pads.
3Reliability
If white oil overflows onto bonding pad area, then oxidation and discoloration of bonding pad occurs, but this can be prevented by improving printing control
Solution Approach 1:
The buffer layer acts as a physical barrier and intermediary that confines the white oil material to the intended printing area. It prevents material overflow onto the bonding pad, ensuring bonding pad reliability while maintaining controlled material deposition.
Solution Approach 2:
The buffer layer is positioned in advance to preemptively prevent white oil from reaching the bonding pad area. This preliminary protective measure stops oxidation and discoloration before they can occur, ensuring bonding pad integrity.
Data Source
AI summary
A backplane includes a drive substrate, a buffer layer, and a reflective layer. The buffer layer is disposed on the drive substrate. The reflective layer is disposed on the buffer layer. In the present disclosure, the buffer layer is provided on the drive substrate to protect the drive substrate during a screen printing process of the reflective layer. An light emitting diode panel is also provided.