LED Display Backplane Assembly for Easier Micro LED Chip Replacement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current micro LED display panel manufacturing processes face difficulties in removing defective LED chips and trimming replacement chips due to high connection strength between LED chips and the display backplane, making the process challenging and costly.
Innovation Solution
A display backplane assembly with a planarization layer featuring accommodating holes for bonding material and adhesive, allowing for pre-connection of LED chips with partial exposure and easy removal of defective chips, facilitating the installation of new chips with reduced operational force and avoiding damage to bonding materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LED chips are bonded to the display backplane with high connection strength, then electrical connection stability is improved, but defective LED chips become difficult to remove and replacement becomes complex
Solution Approach 1:
The bonding material is segmented into two distinct functional zones: a first bonding region that provides strong electrical connection stability, and a second bonding region that enables easy removal and replacement of LED chips. This segmentation allows the same bonding material to simultaneously achieve both high reliability and ease of repair by differentiating its properties across different spatial regions.
Solution Approach 2:
Different regions of the bonding material exhibit different local qualities: the first bonding region has high adhesion strength for stable electrical connection, while the second bonding region has reduced adhesion strength for easy chip removal. This local quality differentiation resolves the contradiction by optimizing each region for its specific function rather than using uniform properties throughout.
2Reliability
If high bonding strength is used to secure LED chips, then connection reliability is improved, but operational complexity increases when trimming replacement chips
Solution Approach 1:
The bonding interface is divided into two functional segments: a first bonding region with strong adhesion for reliable connection, and a second bonding region with weak adhesion for easy chip removal and replacement. This segmentation simplifies the replacement operation by providing a predetermined weak bonding area where chips can be easily separated without damaging the bonding material or requiring complex trimming procedures.
Solution Approach 2:
The second bonding region acts as an intermediary zone that mediates between the need for strong connection (first bonding region) and the need for easy removal (replacement operation). This intermediary region with controlled weak bonding allows chips to be easily separated while protecting the bonding material from damage, thereby reducing operational complexity.
3Reliability
If strong bonding is applied to ensure stable electrical connection, then reliability is improved, but processing complexity and costs increase
Solution Approach 1:
The bonding material is divided into two functional regions during the manufacturing process: a first bonding region with strong adhesion for reliable electrical connection, and a second bonding region with weak adhesion for easy chip replacement. This segmentation enables simplified manufacturing and processing by providing a predetermined weak bonding area that facilitates chip removal and replacement without requiring complex processing steps or additional costs.
Solution Approach 2:
The bonding material exhibits different local qualities across its structure: strong bonding in the first region for reliability, and weak bonding in the second region for ease of manufacture during replacement operations. This local quality differentiation reduces processing complexity and costs by eliminating the need for complex removal procedures while maintaining reliable electrical connections where needed.
Data Source
AI summary
A display backplane assembly, a light-emitting diode (LED) display module and a device, and related methods for manufacturing the same are provided in the disclosure. The display backplane assembly includes a display backplane and a planarization layer. The display backplane has a first surface, and electrode connecting pads are disposed on the first surface. The planarization layer is stacked on the first surface and defines multiple accommodating holes extending in a thickness direction of the planarization layer. The multiple accommodating holes correspond to the electrode connection pads. Each of the multiple accommodating holes includes a first hole and a second hole. A bonding material is filled in the first hole and in contact with the electrode connection pad. An adhesive is filled in the second hole.