Mini/Micro LED Backplane With Curved Optics for Light Extraction
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Solution Overview
Problem
Existing display technologies using mini/micro LED backplanes suffer from low light extraction efficiency and high production costs due to the use of flat protective layers that cause significant total internal reflection and require excessive encapsulating adhesive.
Innovation Solution
A backplane design featuring a substrate with a reflective layer and optical structures with curved light exit surfaces, reducing total reflection and enhancing light extraction efficiency while minimizing encapsulating adhesive use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat protective layer is used to cover LED chips, then the LED chips are protected, but light extraction efficiency decreases due to total internal reflection
Solution Approach 1:
The patent applies curvature to the protective layer by forming convex lenses on the surface. These convex lenses change the light extraction interface from flat to curved, reducing total internal reflection and enabling more light to escape from the LED chips while maintaining chip protection.
Solution Approach 2:
The patent transitions from a two-dimensional flat protective surface to a three-dimensional curved surface with convex lenses. This dimensional change creates additional light extraction pathways and angles, effectively reducing total internal reflection and improving light extraction efficiency.
2Reliability
If a flat protective layer with high coverage is used, then LED chips are well protected, but the amount of encapsulating adhesive increases production costs
Solution Approach 1:
The convex lens structure concentrates the protective function at specific elevated points rather than requiring continuous adhesive coverage. The curved surfaces of the lenses provide mechanical protection and light management functions, reducing the need for excessive encapsulating adhesive.
Solution Approach 2:
The protective layer is segmented into discrete convex lens structures rather than a continuous flat layer. Each lens independently protects underlying LED features while the segmented structure reduces overall adhesive material requirements compared to a continuous coverage approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves light extraction efficiency and reduces production costs by optimizing light reflection and adhesive usage, while protecting the LED chips.
Implementation Method 1
flat protective layers that cause significant total internal reflection
Implementation Method 2
enhancing light extraction efficiency
Implementation Method 3
The first reflective layer is disposed on a bearing surface of the substrate... The first reflective layer includes a plurality of through holes spaced apart
Data Source
AI summary
A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.