LED Barrier Layer Prevents Metal Diffusion

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Solution Overview

Problem

Conventional light-emitting diodes face challenges in preventing metal diffusion between the metal reflective layer and the metal connecting structure, leading to decreased reflectivity and luminous intensity, especially when using the same metal element on both sides of the barrier layer, which is exacerbated by high-temperature bonding processes.

Innovation Solution

A light-emitting device structure incorporating a dielectric layer with a first and second part separated by a through hole, a metal reflective layer, a barrier layer comprising a first and second metal multilayer, and a metal connecting structure formed using low-temperature fusion materials, effectively preventing metal diffusion by using different metal elements in the barrier layer and connecting structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thin barrier layer is used to prevent metal diffusion between the metal reflective layer and the metal connecting structure, then the barrier layer can effectively block metal diffusion at low temperatures, but the barrier layer becomes insufficient at high temperatures where metal diffusion occurs despite the barrier layer's presence

Engineering Contradiction:
Improvemetal diffusion preventionVSAvoidbarrier layer thickness
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies composite materials by creating a metal multilayer barrier layer comprising alternating layers of first metal material and second metal material. This multilayer composite structure provides enhanced metal diffusion prevention capability compared to a single-layer barrier, allowing effective protection at high temperatures without requiring excessive thickness. The different metal materials in the composite structure create multiple diffusion barriers that work synergistically to prevent metal migration between the reflective layer and connecting structure.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent segments the barrier layer into multiple thin alternating layers of different metal materials rather than using a single thick layer. This segmentation creates multiple interfaces that impede metal diffusion paths, with each metal layer acting as a separate barrier. The segmented multilayer structure achieves superior diffusion prevention with reduced overall thickness compared to a conventional single-layer barrier.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If the metal connecting structure and metal reflective layer comprise the same metal element, then bonding can be facilitated, but other elements in the alloy become particularly easy to combine with the same metal element on both sides of the barrier layer, causing metal diffusion

Engineering Contradiction:
Improvebonding facilitationVSAvoidmetal diffusion prevention
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent uses composite materials in the metal multilayer barrier layer where alternating layers of different metal materials create a complex diffusion barrier. This composite structure is specifically effective when the metal connecting structure and reflective layer share the same metal element, as the alternating metal layers in the barrier prevent other alloy elements from migrating across the interface, thereby maintaining bonding ease while preventing diffusion.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The metal multilayer barrier layer acts as an intermediary structure between the metal connecting structure and metal reflective layer. When both sides contain the same metal element, this intermediary multilayer barrier prevents direct interaction and diffusion of other alloy elements, mediating the interface to maintain both bonding facilitation and diffusion prevention.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If a thick barrier layer is used to prevent metal diffusion at high temperatures, then metal diffusion can be effectively prevented, but stress issues arise due to the excessive thickness of the barrier layer

Engineering Contradiction:
Improvemetal diffusion preventionVSAvoidinternal stress
Core Design Contradiction:
ReliabilityVSStress or pressure

Solution Approach 1:

The patent employs composite materials through a metal multilayer barrier structure that achieves effective metal diffusion prevention at high temperatures without requiring excessive thickness. The alternating metal layers create multiple diffusion barriers that collectively provide high-temperature protection, eliminating the need for a single thick barrier layer that would generate internal stress.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent segments the barrier function into multiple thin alternating metal layers rather than using one thick layer. This segmentation provides sufficient diffusion prevention at high temperatures while keeping each individual layer thin, thereby avoiding the stress issues associated with thick single-layer barriers.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents metal diffusion, maintaining high reflectivity and luminous intensity by using a multilayer barrier structure with different metal elements, avoiding stress issues associated with thick barrier layers and ensuring reliable performance in applications like the automotive field.

Implementation Method 1

The barrier layer 107 is disposed between the metal reflective layer 106 and the metal connecting structure 108 to prevent metal diffusion between the metal reflective layer 106 and the metal connecting structure 108

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Implementation Method 2

The metal reflective layer 106 is for reflecting light emitted by the light-emitting stack 102

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 3

a light-emitting stack 102... for reflecting light emitted by the light-emitting stack 102

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS10553761B2Light-emitting device and manufacturing method thereof
Publication Date: 2020.02.04 ENNOSTAR CORP
  • US10553761B2 patent drawing
  • US10553761B2 patent drawing
  • US10553761B2 patent drawing

AI summary

A light-emitting device includes a metal connecting structure; a metal reflective layer on the metal connecting structure; a barrier layer between the metal connecting structure and the metal reflective layer; a light-emitting stack on the metal reflective layer; a dielectric layer between the light-emitting stack and the metal reflective layer, and a first extension electrode and a second extension electrode on the light-emitting stack and away from the metal reflective layer. The dielectric layer includes a first part and a second part separated from the first part from a cross section of the light-emitting device. The first extension electrode and the second extension electrode respectively align with the first part and the second part. From a cross section of the light-emitting stack, the first extension electrode has a first width and the first part has a second width larger than the first width.