LED Base Module Separating Wall Thermal Interference
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Solution Overview
Problem
The production of LED lighting devices faces technical, funding, and equipment barriers due to the structural design of conventional LED lighting devices, hindering their widespread adoption and replacement of traditional lighting solutions.
Innovation Solution
An LED base module with a substrate and driving units, featuring a separating wall to reduce thermal and electromagnetic interferences, allows direct bonding with an LED chip and includes a circuit layer, electrodes, and packaging elements for efficient electrical connection, enabling the module to function as a standalone lighting unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional LED lighting device production processes are used, then lighting function is achieved, but technical barriers and high manufacturing thresholds are generated
Solution Approach 1:
The patent integrates the LED chip, driving components, circuit board, and heat dissipation structure into a single integrated base module. This merging of previously separate components into one unified structure simplifies the manufacturing process and reduces the number of assembly steps required, directly addressing the technical contradiction between ease of manufacture and device complexity.
Solution Approach 2:
The base module is designed as a separable unit that can be independently manufactured and then installed as a complete assembly. This segmentation allows the complex integrated module to be produced separately and then easily installed, reducing the manufacturing threshold while maintaining the benefits of integration.
2Area of stationary object
If LED driving component and LED chip are placed close together, then space is saved, but thermal and electromagnetic interferences increase
Solution Approach 1:
The patent introduces a partition wall as an intermediary structure between the LED chip and the driving component. This partition wall acts as a barrier that blocks thermal radiation and electromagnetic interference while still allowing the components to be housed within a compact base module structure, thus resolving the contradiction between space efficiency and harmful factor reduction.
Solution Approach 2:
The base module employs different structural characteristics in different regions: the LED chip area has direct heat dissipation pathways, while the driving component area is separated by a partition wall to reduce interference. This local differentiation of structural quality allows optimal performance in each region while maintaining overall compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the manufacturing threshold for LED lighting devices and effectively minimizes thermal and electromagnetic interferences, facilitating the integration of LED technology into mainstream lighting solutions.
Implementation Method 1
the separating wall is provided for separating the LED driving component from the LED chip, thereby reducing thermal and electromagnetic interferences between the LED driving component and the LED chip
Implementation Method 2
the separating wall is provided for separating the LED driving component from the LED chip, thereby reducing thermal and electromagnetic interferences between the LED driving component and the LED chip
Data Source
AI summary
An LED base module includes a substrate and several driving units disposed on the substrate. Each driving unit includes a circuit layer, a separating wall, an LED driving component, a packaging member, and two electrodes. The circuit layer, the separating wall, and the electrodes are disposed on the substrate. A portion of the substrate corresponding to each driving unit is provided with an LED area and an electronic component area defined by the separating wall. The LED driving component is disposed on a portion of the circuit layer arranged in the electronic component area. The packaging member is formed on the electronic component area to entirely cover the LED driving component. A portion of the circuit layer arranged in the LED bonding area is used to bond to an LED chip, and the separating wall is configured to separate the LED chip and the LED driving component.