LED Lamp Bead Array Transfer Using Release Layer Evaporation
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Solution Overview
Problem
The existing mass transfer methods for LED lamp beads face challenges in precision and efficiency due to the small size of mini-LED/micro-LED components, requiring high precision and handling large quantities, which results in low transfer efficiency and high operational difficulty.
Innovation Solution
A method involving a growth substrate with an LED lamp bead array connected through a release layer, aligned with a driver circuit substrate's lamp mount array, and then the release layer is evaporated to separate the LED lamp beads, allowing for simultaneous transfer of multiple beads without the need for individual handling, utilizing a workbench and robot arm for precise alignment and detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If individual LED lamp beads are transferred one by one from the growth substrate to the driver circuit substrate, then each bead can be precisely positioned, but the transfer efficiency is extremely low and the operational difficulty is very high
Solution Approach 1:
The patent merges multiple individual transfer operations into a single batch transfer operation by maintaining the LED lamp bead array structure on the growth substrate and transferring the entire array to the driver circuit substrate simultaneously. This is achieved by evaporating the release layer to detach the entire array at once, thereby dramatically improving transfer efficiency and reducing operational complexity compared to individual bead transfers.
Solution Approach 2:
The patent applies preliminary action by pre-aligning the growth substrate with the driver circuit substrate before the transfer operation. The alignment marks are prepared in advance, and the substrates are positioned and aligned beforehand, so that when the release layer is evaporated, the LED lamp bead array is already in the correct position for high-efficiency batch transfer without requiring individual positioning during the transfer process.
2Productivity
If the LED lamp bead array is transferred as a whole from the growth substrate to the driver circuit substrate, then transfer efficiency is greatly improved, but precise alignment between the LED lamp bead array and lamp mount array becomes more difficult
Solution Approach 1:
The patent introduces alignment marks as intermediary reference elements on both the growth substrate and the driver circuit substrate. These alignment marks serve as mediators that facilitate precise alignment between the LED lamp bead array and the lamp mount array during the batch transfer process, enabling high-precision positioning without requiring individual bead alignment.
Solution Approach 2:
The patent replaces manual or mechanical individual positioning methods with an automated alignment system that uses optical alignment marks and controlled substrate positioning. This substitution allows for precise alignment of the entire LED lamp bead array at once, maintaining manufacturing precision while achieving high transfer efficiency through batch processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the transfer efficiency and alignment accuracy of LED lamp beads, reducing the complexity and cost associated with existing methods by enabling the transfer of a large number of beads at once, thereby enhancing production speed and reducing equipment wear.
Implementation Method 1
evaporating the release layer and removing the first substrate
Data Source
AI summary
A mass transfer method for LED lamp beads, including: providing a growth substrate, the growth substrate includes a first substrate and an LED lamp bead array disposed on one surface of the first substrate, LED lamp beads of the LED lamp bead array are connected to the first substrate through a release layer; providing a driver circuit substrate, the driver circuit substrate includes a second substrate and a lamp mount array disposed on one surface of the second substrate, the lamp mount array is matched with the LED lamp bead array; moving the growth substrate to a position above the driver circuit substrate, and rotating the growth substrate and/or the driver circuit substrate so that the LED lamp bead array is aligned with the lamp mount array; and evaporating the release layer and removing the first substrate.