LED Package Black Layer for Contrast Improvement
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Solution Overview
Problem
Existing light emitting diode (LED) display devices face challenges in improving contrast due to reflection of incident light from external sources, particularly from electrodes and power lines on the package substrate, which are not effectively covered by traditional black resist methods.
Innovation Solution
A light emitting diode configuration that includes a package substrate with an electrode, a light emitting diode chip, and a power line connected by a black layer with low reflectance, where the black layer covers the electrode and power line, reducing external light reflection and enhancing contrast. The black layer is formed after connecting the light emitting diode chip and electrode, and its thickness is optimized to minimize light emission interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the black resist is formed to cover the electrode completely, then light reflection is suppressed, but the manufacturing process becomes more complex
Solution Approach 1:
The black resist is formed on the package substrate before the electrode is mounted. This preliminary formation of the black resist layer simplifies the overall manufacturing process by establishing the reflective suppression structure early in the fabrication sequence, avoiding the need for additional post-processing steps to add blackening materials after electrode assembly.
2Object-affected harmful factors
If the black resist is formed after connecting the light emitting diode chip and electrode, then the reflective areas are effectively covered, but the manufacturing sequence becomes more complex
Solution Approach 1:
The black resist is formed on the package substrate before the electrode is mounted, not after. This preliminary action simplifies the manufacturing sequence by establishing the reflective suppression structure early, allowing subsequent electrode mounting and wire bonding to proceed without interruption, and avoiding the need for additional alignment and positioning steps that would be required if the black resist were formed after assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses external light reflection, improving the contrast of the light emitting diode display device by ensuring the black layer covers the reflective areas without significantly reducing light emission, thereby enhancing the perceived blackness and maintaining the viewing angle.
Implementation Method 1
a black layer covering the electrode including a part connected to the power line
Data Source
AI summary
Provided are a light emitting diode capable of improving contrast, a method for manufacturing a light emitting diode, a light emitting diode display device, and a method for manufacturing a light emitting diode display device. The light emitting diode according to an embodiment comprises a package substrate having an electrode provided therein; a light emitting diode chip provided on the package substrate; a power line electrically connecting the light emitting diode chip to the electrode; and a black layer covering the electrode including a part connected to the power line.