Light Emitting Element Bonded Board Optical Axis Alignment
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Solution Overview
Problem
It is challenging to accurately integrate a light emitting element with an optical waveguide due to their separate nature, leading to difficulties in precise optical axis alignment and light loss.
Innovation Solution
A light emitting element bonded board is designed with an optical waveguide formed within a board, featuring a hollowed portion for the light emitting element and conductive vias in the upper and lower layers, where the optical axis of the light emitting element coincides with the optical waveguide's center line, and is bonded to the conductive portions for precise alignment and reduced light loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light emitting element and optical waveguide are separate parts, then manufacturing flexibility is improved, but alignment precision deteriorates
Solution Approach 1:
The patent introduces a hollowed portion as an intermediary structure that pre-positions the light emitting element within the board. This hollowed portion acts as a mechanical guide and support, ensuring that when the light emitting element is installed, its optical axis automatically aligns with the optical waveguide's center line, thus resolving the alignment precision issue while maintaining manufacturing flexibility
Solution Approach 2:
The hollowed portion is formed in advance during board manufacturing, creating a pre-prepared mounting structure. This preliminary action ensures that the light emitting element will be positioned correctly before actual assembly, eliminating alignment difficulties that would otherwise require complex post-assembly adjustments
2Adaptability or versatility
If the light emitting element is separately mounted, then device modularity is improved, but light transmission efficiency deteriorates
Solution Approach 1:
The patent merges the light emitting element installation structure with the board itself by forming a hollowed portion directly in the board. This integration ensures precise optical axis alignment between the light emitting element and optical waveguide, minimizing light loss while preserving the modular advantage of separate component installation
Data Source
AI summary
A light emitting element bonded board includes an optical waveguide formed within a board, a hollowed portion in the board, a light emitting element installed in the hollowed portion, and a conductive portion formed in an upper layer and/or a lower layer of the optical waveguide, wherein an optical axis of the light emitting element coincides with a center line of the optical waveguide, and a bonding portion of the light emitting element is bonded to the conductive portion.