Light Emitting Device Array Bonding Layer Segmentation
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Solution Overview
Problem
Existing light emitting device arrays face challenges in achieving optimal light extraction efficiency and structural integrity due to limitations in bonding layer placement and material composition, which affect the performance and reliability of the devices.
Innovation Solution
A light emitting device array design featuring a first supporting member with multiple bonding layers, a second supporting member with a concave-convex structure, and a metal layer connecting neighboring devices, utilizing materials like molybdenum, silicon, and aluminum for conductivity and adhesion layers to enhance electrical and thermal conductivity, and improve light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bonding layer is placed extending to the edge of the light emitting structure, then the structural support is maximized, but the light extraction efficiency deteriorates due to bonding material absorption and scattering
Solution Approach 1:
The bonding layer is segmented into two distinct regions: a first bonding layer that contacts the back surface of the light emitting structure and provides structural support, and a second bonding layer that extends toward the edge but is separated from the light emitting structure by a gap. This segmentation allows each bonding layer to fulfill its specific function without compromising the other - the first layer provides mechanical strength while the second layer minimizes light extraction interference.
Solution Approach 2:
Different regions of the bonding structure are assigned different properties and functions. The first bonding layer has properties optimized for mechanical bonding and structural support, while the second bonding layer is positioned and configured to minimize its impact on light extraction. The gap region is specifically designed to allow light passage while maintaining overall structural integrity through the combined bonding layers.
2Ease of manufacture
If a single-layer bonding structure is used, then the manufacturing process is simplified, but the light extraction efficiency deteriorates due to uniform bonding material distribution
Solution Approach 1:
The bonding structure is divided into multiple layers with distinct functions. The first bonding layer provides mechanical attachment to the substrate, while the second bonding layer is positioned to minimize light extraction interference. This multi-layer segmentation allows optimization of each layer's properties for its specific purpose, improving overall light extraction efficiency without significantly complicating the manufacturing process.
3Strength
If the bonding layer material has high adhesion strength, then the structural integrity is improved, but the light extraction efficiency deteriorates due to increased light absorption and scattering
Solution Approach 1:
The bonding function and light transmission function are segmented into different layers. The first bonding layer uses materials with high adhesion strength for structural integrity, while the second bonding layer is positioned and configured to minimize light extraction interference. This segmentation allows high adhesion strength materials to be used where needed without compromising light extraction efficiency.
Solution Approach 2:
Different materials with appropriate properties are used in different regions of the bonding structure. The first bonding layer uses high adhesion strength materials for mechanical bonding, while the overall bonding structure is configured to minimize light absorption and scattering in the light extraction path.
Data Source
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AI summary
A light emitting device array includes a first supporting member (230), at least two bonding layers (170) disposed on the first supporting member, a second supporting member (160) disposed on each of the at least two bonding layers, a light emitting structure (120,130,140) disposed on the second supporting member, the light emitting structure comprising a first conductivity type semiconductor layer (120), a second conductivity type semiconductor layer (140) and an active layer (130) disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, and a first electrode (190) disposed on the light emitting structure.