LED Bonding Carriers Using Non-Parallel Substrate Contact
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Solution Overview
Problem
The manufacturing process of light-emitting diode displays faces complications and lower throughput due to the complexity of the pick-and-place apparatus used for transferring LED components from one substrate to another.
Innovation Solution
An apparatus and method for bonding electronic components, featuring a first and second carrier with a driving mechanism and substrate adjustment mechanism, allowing substrates to be positioned in a non-parallel configuration and an energy beam generator to bond the components by moving them closer and applying an energy beam for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a pick-and-place apparatus is used to transfer LED components from one substrate to another, then the electronic component transfer can be achieved, but the operation becomes more complicated and the throughput or yield decreases
Solution Approach 1:
The patent replaces the complex mechanical pick-and-place apparatus with a direct bonding system using a first carrier and second carrier that move toward each other to achieve contact and bonding of substrates, eliminating the need for picking and placing operations
Solution Approach 2:
The patent merges the transfer and bonding operations into a single process where the first substrate and second substrate with electronic components are directly bonded together through controlled movement and contact, rather than separate pick-and-place operations
2Device complexity
If substrates are positioned in a non-parallel configuration during bonding, then the bonding process is simplified, but precise alignment and contact control becomes more difficult
Solution Approach 1:
The patent employs a driving mechanism that enables dynamic adjustment of the relative positions and orientations of the first carrier and second carrier, allowing the substrates to be positioned in a non-parallel configuration during bonding while maintaining control through controlled movement
Solution Approach 2:
The patent changes the geometric parameters of substrate positioning by allowing non-parallel configuration during the bonding process, using the driving mechanism to control the approach and contact while simplifying the overall bonding operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the transfer and bonding process, improving productivity and yield by enabling efficient contact and bonding of electronic components, such as LEDs, between substrates.
Implementation Method 1
an energy beam generator generating an energy beam towards the first carrier and the second carrier
Data Source
AI summary
An apparatus for bonding an electronic component including a first carrier, a second carrier, a driving mechanism, and a substrate adjustment mechanism is disclosed. The first carrier is configured to carry a first substrate and has a first carrying surface. The second carrier is configured to carry a second substrate and has a second carrying surface. The driving mechanism enables the first carrier and the second carrier to act in close proximity to each other and far away from each other. The substrate adjustment mechanism enables the first substrate and the second substrate disposed to be in a non-parallel configuration.