LED Bonding Pad Layout for Linearity and Thrust Resistance
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Solution Overview
Problem
Traditional bonding pads in light-emitting devices are insufficient in meeting the requirements of linearity and thrust resistance, leading to issues such as uneven brightness and picture quality in displays.
Innovation Solution
The use of a circuit board with a bonding pad design featuring a radial configuration of traces and an L-shaped bonding line, where the first section is perpendicular to the second section, and traces extend in various inclined directions to enhance alignment accuracy and resist thrusts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional bonding pads are used, then the device complexity is low, but the linearity and thrust resistance requirements cannot be met
Solution Approach 1:
The bonding pad structure is segmented into multiple functional components: a bonding line with first and second sections, and multiple traces (5-10 traces) extending in radial directions. This segmentation allows each component to perform specific functions - the bonding line provides primary mechanical support while the traces distribute thrust forces in multiple directions, collectively achieving superior linearity and thrust resistance compared to traditional monolithic bonding pads.
Solution Approach 2:
The bonding pad design transitions from a simple linear or planar structure to a multi-dimensional radial configuration. The traces extend in multiple directions (0°, 45°, 90°, 135°, etc.) relative to the bonding line, creating a three-dimensional force distribution network. This dimensional expansion enables the structure to resist thrusts from various directions simultaneously, significantly improving linearity while maintaining reasonable complexity.
2Illumination intensity
If the number of light-emitting diodes is increased, then the display brightness is improved, but the mounting accuracy and linearity requirements increase
Solution Approach 1:
The bonding pad structure is pre-configured with multiple traces extending in specific radial directions before the light-emitting diodes are mounted. This preliminary arrangement of support structures ensures that when multiple LEDs are mounted, each device receives uniform mechanical support from multiple angles, pre-establishing the conditions for high mounting accuracy and linearity across the entire display array.
Solution Approach 2:
The bonding pad design changes key structural parameters: the bonding line includes a first section and a second section at specific angles, and multiple traces are positioned at predetermined angular intervals (e.g., 0°, 45°, 90°, 135°). These parameter changes create a balanced mechanical field that accommodates multiple light-emitting diodes with consistent positioning, enabling high mounting accuracy even as the number of LEDs increases to enhance display brightness.
3Area of stationary object
If the bonding pad size is reduced, then the device integration is improved, but the thrust resistance is reduced
Solution Approach 1:
The bonding pad structure compensates for reduced area by transitioning to a multi-dimensional configuration. Instead of relying on a large single-plane area, the design uses a bonding line with sections at different angles and multiple traces extending radially in three-dimensional space. This dimensional transformation allows a compact bonding pad to distribute thrust forces across multiple directional vectors, maintaining high thrust resistance despite the reduced overall area.
Solution Approach 2:
The compact bonding pad is segmented into multiple functional elements - the bonding line with first and second sections, and 5-10 traces positioned at various angles. Each segment contributes to thrust resistance in its specific direction, and the collective action of all segments provides comprehensive mechanical support. This segmentation allows the small bonding pad area to achieve thrust resistance comparable to or exceeding larger traditional bonding pads.
Data Source
AI summary
An electrical module is provided. The electrical module includes a circuit board. The circuit board includes at least one bonding pad. The bonding pad includes a bonding line and a plurality of traces. The traces are connected to the bonding line. The traces are configured in a radial manner. The bonding line includes a first section and a second section. The first section is connected to the second section. The first section extends in a first direction. The second section extends in a second direction. The first direction is perpendicular to the second direction. An extending direction of at least one of the traces differs from the first direction and the second direction.

