Light Emitting Device Bonding Strength via Recessed Frame Anchoring
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Solution Overview
Problem
Light emitting devices with a frame body on the periphery of the light emitting element experience insufficient bonding strength, leading to detachment when used in vibrating environments.
Innovation Solution
A light emitting device design featuring a support substrate with conductive wiring, a light emitting element bonded with a bonding member, and a frame body having recessed portions with an underlying and extended portion to enhance bonding strength by directing surplus bonding material to areas of higher wettability, reducing detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a frame body is provided on the periphery of the light emitting element to improve mounting accuracy, then mounting precision is improved, but bonding strength deteriorates
Solution Approach 1:
The conductive wiring is divided into two functional segments: an underlying portion directly beneath the light emitting element for bonding, and an extended portion reaching into recessed portions of the frame body for anchoring. This segmentation allows each part to perform its specialized function optimally - the underlying portion provides bonding surface while the extended portion provides mechanical interlocking with the frame body, thereby simultaneously achieving mounting precision and bonding strength
Solution Approach 2:
The conductive wiring extends from the two-dimensional plane beneath the light emitting element into the third dimension by reaching into the recessed portions of the frame body. This dimensional transition creates a mechanical interlocking structure where the wiring protrudes into the frame body's recesses, providing enhanced anchoring and preventing detachment while maintaining accurate positioning
2Quantity of substance
If bonding material is applied generously to ensure coverage, then bonding coverage is improved, but bonding strength deteriorates due to insufficient volatilization
Solution Approach 1:
The extended portion of the conductive wiring is extracted into the recessed portions of the frame body, creating dedicated spaces for bonding material placement. This extraction ensures that bonding material is concentrated in specific locations where it can be properly volatilized and bonded, rather than being spread thinly across a large area, thereby achieving both adequate coverage and sufficient bonding strength
Solution Approach 2:
The conductive wiring provides different local qualities at different locations: the underlying portion offers a bonding surface with appropriate material properties for adhesion, while the extended portions within recessed areas provide confined spaces that facilitate proper bonding material volatilization and curing. This local differentiation ensures optimal bonding conditions at each specific location, achieving both coverage and strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces detachment of the light emitting element even in vibrating environments by improving bonding strength through efficient volatilization of the bonding material within the recessed portions.
Implementation Method 1
a bonding member interposed therebetween
Data Source
AI summary
A light emitting device includes a support substrate; a conductive wiring located on an upper surface of the support substrate; a light emitting element disposed on an upper surface of the conductive wiring via a bonding member interposed therebetween; and a frame body located on an upper surface of the support substrate. The frame body has a plurality of recessed portions on an inner lateral surface surrounding the light emitting element in a top view of the light emitting device. The conductive wiring includes an underlying portion located directly under the light emitting element, and at least two extended portions extending from the underlying portion to a location inside of at least two respective ones of the recessed portions in a top view of the light emitting device.